I. Product Positioning and Overview
The Abner R series upright metallurgical microscopes are designed for observing the surface morphology and microstructure of samples such as metallic materials, semiconductor materials, electronic packaging, solder joints/coatings/plated layers, ceramics and composite materials. The system adopts an infinity-corrected metallurgical optical system and a modular body platform design. It supports multiple observation modes including bright field (BF), dark field (DF), polarized light (POL), differential interference contrast (DIC, optional), and fluorescence (optional). It can also be expanded with high-resolution digital imaging, measurement analysis and image stitching, meeting multi-scenario requirements for laboratory research, process verification, IQC/IPQC/OQC quality inspection and failure analysis.
The R series emphasizes three points:
Reliable imaging: Metallurgy-specific infinity optical path plus high numerical aperture metallurgical objective lenses ensure clarity and contrast at 1000× magnification;
Stable structure: Heavy-duty body, low center of gravity, rigid guide rails and high-precision focusing mechanism, suitable for long-time recording and measurement;
Expandable configuration: From basic quality inspection to semiconductor/material research, it can be upgraded step by step as required without repeated investment.
II. Core Application Scenarios
Metallic Materials: Grain size, inclusions, phase composition, heat-treated microstructure, coating/penetration layer
Semiconductors and Electronics: Wafer surface defects, scratches/particles, metal wiring, solder joints/bonding, package cross-sections
Coatings and Thin Films: Thickness/uniformity, pores/cracks, interfacial bonding
Ceramics/Composite Materials: Microstructure, porosity, interfacial layers and fracture morphology
Teaching and Scientific Research: Metallographic experiments, basic materials science experiments, process comparison and verification
III. Product Features
Infinity optical system dedicated to metallography: High contrast and low aberration, suitable for metallographic observation requirements such as bright field, dark field and polarized light.
Upright configuration plus large-travel mechanical stage: Ideal for irregular, large-sized or heavy samples with intuitive operation.
Expandable multiple observation modes: BF/DF/POL are available as standard options; DIC and fluorescence can be upgraded to meet comparison requirements for different materials.
Highly stable focusing mechanism: Coarse and fine coaxial focusing with delicate fine adjustment, ensuring no drift during long-term observation.
Professional imaging and measurement software (optional): Supports calibration, length/angle/area measurement, particle statistics, image stitching and depth-of-field composition.
Industrial-grade interfaces and expandability: Compatible with C-mount /0.5×/1× adapters to enable matching with large-format cameras and system upgrades.
IV. Technical Parameters
1. Optical System
Optical System: Infinity Metallurgical Optical System
Observation Head: Trinocular observation head (binocular/trinocular optional), 30° tilt; Interpupillary distance adjustment: 48–75 mm
Eyepiece: 10×/22 mm (standard); Optional 10×/20, 15×/16, 20×/12, etc.
Diopter Adjustment: Adjustable diopter for left and right eyepieces (typically ±5D)
2. Observation Modes (Illumination and Modules)
Bright Field (BF): Supported (reflected-light metallurgical bright field)
Dark Field (DF): Supported (optional dark field module / dark field objective or dark field accessories)
Polarization (POL): Supported (optional polarizer + analyzer; rotatable stage version available)
Differential Interference Contrast (DIC): Optional (DIC prism set + DIC objectives)
Fluorescence (FL): Optional (multi-channel fluorescence module for observation of material defects, contamination and residues)
3. Objective Lens System (Compatible with Metallurgical BF/DF)
Objective Mount: RMS or M25 (depending on platform version), compatible with 5-hole / 6-hole nosepiece
Standard Recommended (Metallurgical Bright Field): 5×/0.12 (WD≥20 mm), 10×/0.25 (WD≥10 mm), 20×/0.40 (WD≥8 mm), 50×/0.70 (WD≥3 mm), 100×/0.80 (dry objective) or 100×/1.25 (oil objective, optional). Optional: Long Working Distance (LWD) metallurgical objectives, bright-dark field combined objectives, DIC dedicated objectives
4. Magnification and Imaging Performance
Total Visual Magnification (typical): 50×–1000× (varies with eyepiece and objective configuration)
Digital Imaging: C-mount camera port available, compatible with 1/2.3"–1" large-format industrial cameras / scientific cameras
Field of View: Changes with eyepiece field number and camera sensor size (typical 22 mm field of view)
5. Reflected Illumination System (Core)
Illumination Method: Reflected Köhler Illumination
Light Source: Standard: High-brightness LED (color temperature approx. 5000–6500K, adjustable). Optional: 12V/50W halogen lamp (for scenarios requiring a more continuous spectrum). Brightness adjustment: Continuously adjustable. Diaphragms: Field diaphragm, aperture diaphragm (for contrast / depth of field control). Filters: Blue / green / yellow / frosted and others (optional)
6. Stage and Sample Compatibility
Stage Type: Double-layer mechanical stage (wear-resistant surface). Travel range (typical): X 75–100 mm, Y 50–75 mm (varies by version). Reading accuracy: 0.1 mm (typical); higher-precision vernier / encoder versions optional. Sample compatibility: Metallographic specimens, cross-section samples, wafers (wafer holder / stage required as an accessory)
7. Focusing System
Focusing Mode: Coaxial coarse and fine focusing
Fine Focusing Precision: 2 μm (typical)
Stage Vertical Travel: ≥25 mm (typical)
Collision Protection: Optional (upper limit / objective collision prevention)
8. Main Body and Ergonomics
Body Structure: High-rigidity metal body with low-center-of-gravity design
Controls: Brightness knob, illumination switch, (optional) camera trigger / module switching
Interfaces: Camera port (C-mount / adapter lens); HDMI / USB3.0 solutions optional (depends on camera)
9. Software Functions
Image Acquisition: Real-time preview, exposure/gain/white balance, HDR (subject to camera support)
Calibration: Multi-magnification calibration and automatic invocation
Measurement: Point-to-point distance, line distance, angle, circle/arc, area, perimeter, porosity
Statistics: Particle/inclusion counting, particle size distribution, area ratio
Processing: Contrast enhancement, noise reduction, sharpening, pseudo-color
Stitching: Multi-field stitching (manual/semi-automatic)
Depth-of-Field Fusion: Multi-focal plane fusion (for rough surfaces)
Report: Automatic generation of graphic reports (Word/PDF templates)
10. Environment and Electrical Specifications
Power Supply: AC 100–240V, 50/60Hz
Operating Environment: Temperature 5–35°C; Humidity 20–80%RH (non-condensing)
Safety: Overcurrent/overvoltage protection (included with power module)
V. Application Scenarios for Semiconductor Materials
Typical Samples: Si / SiC / GaN wafers, thin-film devices, microstructure specimens
Applications:
Detection of scratches, particles and contamination on wafer surfaces
Inspection of pattern integrity and edge quality after photolithography
Microscopic observation of metal interconnections, pads and bonding areas
Surface and interface analysis before and after chip packaging
Advantages of R Series:
Upright structure suitable for reflective observation and process inspection
Optional darkfield mode to improve contrast of micro-defects
Compatible with high-definition cameras and measurement software, suitable for process quality inspection and R&D
Component Drawing
