Type | Typical Temperature Range | Structural Characteristics | Core Advantages | Remarks |
Standard Laboratory Heating Stage |
Room temperature ~ 200℃ (expandable to 300℃)
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Heating surface made of aluminum alloy or anodized aluminum Embedded resistive heating module Integrated temperature sensor (PT100 / Thermocouple) Independent PID temperature control module
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Mature structure with controllable cost Stable temperature rise and excellent temperature uniformity Easy maintenance, suitable for long-term experimental use
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Conventional material heating experiments Sample annealing, drying and pretreatment Teaching laboratories and basic scientific research platforms
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Microscope-coupled Heating Stage | Room temperature ~ 250℃ (higher temperatures customizable) |
Ultra-thin heating structure, compatible with microscope working distance Central opening design, suitable for transmitted light or confocal systems Thermal drift prevention structure, reduces the impact of thermal expansion on imaging
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Real-time microscopic observation is available under heating status High temperature stability with minimal imaging interference Compatible with metallurgical microscopes, inverted microscopes and fluorescence microscopes
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Real-time microscopic observation can be performed under heating conditions High temperature stability with minimal interference to imaging Compatible with metallurgical microscopes, inverted microscopes and fluorescence microscopes
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Semiconductor / Wafer Heating Stage | Room temperature ~ 300℃/500℃ (optional) |
Compatible with 2/4/6/8-inch wafers High flatness with temperature uniformity better than ±1–2 ℃ Optional vacuum adsorption or mechanical compression mode
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Designed for process-level applications Excellent repeatability, suitable for process validation Compatible with probe stations, transfer platforms and coating equipment
| Semiconductor Process Heating Photolithography Pre-bake & Post-bake Thin Film Deposition and Annealing Process |
Vacuum / Inert Atmosphere Heating Stage | Room temperature ~ 500℃ (higher temperatures customizable) |
Integrated into vacuum chamber or glove box system Low outgassing material design Optional vacuum, nitrogen or argon atmosphere
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Prevent sample oxidation and contamination Suitable for high-purity materials and sensitive samples Integratable with plasma, sputtering and evaporation systems
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2D Material Growth and Transfer High-temperature Annealing and Interface Regulation Vacuum Process Validation and Research
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