1. Product Overview
The ABN micro-nano spin coater (ABN-COA-001) is a professional device for precise liquid photoresist coating. It can accurately control the coating process according to factors such as substrate size and photoresist viscosity. Suitable for a variety of micro-nano level coating process scenarios, it achieves uniform photoresist coating performance and meets the strict requirements for coating accuracy and consistency in scientific research and production.
II. Technical Parameters
Rotation Speed Range: 500 - 8000 RPM
Rotation Speed Accuracy: ±1 RPM
Time Setting Range: 1 - 999 s
Acceleration: Max adjustable range 500 - 3000 RPM/s
Applicable Substrate Size: Maximum 400mm × 400mm (customizable)
Power Supply: 220V ±10%, 50/60 Hz
Power Consumption: Approx. 100W
Overall Dimension: 300mm × 300mm × 200mm
Weight: Approx. 10kg
III. Product Features
Flexibly adjustable rotating speedThe rotating speed can be precisely matched according to the viscosity of the glue solution. Low-viscosity glue adapts to a high speed of 3000–6000 RPM, while high-viscosity glue suits a low speed of 500–2000 RPM. With a speed range of 500–8000 RPM and a speed accuracy of ±1 RPM, it ensures uniform coating for different types of glue.
Precise time controlThe time setting ranges from 1 to 999 seconds. The low-speed rotation time is generally 5–20 seconds, and the high-speed rotation time is 30–60 seconds. The coating duration can be flexibly set to meet diverse process requirements.
Fine glue dosage controlThe glue dosage can be adjusted according to the substrate size and glue viscosity, ranging from several microliters to tens of microliters. It achieves precise coating and avoids material waste and uneven coating.
Practical and versatile functionsIt features adjustable acceleration (typically 500–3000 RPM/s), supports substrates up to 4 inches (customizable), and is equipped with a vacuum adsorption function to ensure substrate stability during the coating process.
Good adaptability of operating parametersIt adopts a power supply of 220V±10%, 50/60 Hz with a power consumption of approximately 100W, compatible with common industrial power environments. The overall dimension is 300mm × 300mm × 200mm with a weight of about 10kg. It occupies a small footprint and is easy to install and operate.
IV. Application Scenarios and Fields
Semiconductor and Microelectronics Manufacturing: Used for photoresist coating, as well as preparation of dielectric layers and protective layers.
2D Materials and Nanomaterial Research: Applied to the preparation of transfer auxiliary layers, polymer support layers and functional thin films.
MEMS and Micro-nano Fabrication: Realizes uniform deposition of sacrificial layers, structural layers and functional coatings.
Optical and Optoelectronic Devices: Fabricates optical coatings, photosensitive materials and functional thin films.
Biomedicine and Chemistry Fields: Applied to the preparation of biological coatings, sensing membranes and functionalized surfaces.
New Material R&D: Suitable for research on polymer, sol-gel and composite material thin films.
V. Technical Advantages
High Film Thickness UniformityWith stable speed control and optimized airflow structure, excellent consistency of film thickness is achieved.
Excellent Process RepeatabilityDigital parameter setting reduces manual operation errors and improves experimental repeatability.
Strong CompatibilityIt meets the spin-coating requirements of various solution systems and materials with different viscosities.
Stable and Reliable StructureThe core components adopt a high-stability design, suitable for long-term continuous operation.
Easy-maintenance DesignThe cavity and key components are easy to disassemble and clean, lowering daily maintenance costs.
VI. Typical Types and Application Cases
Type | Model Positioning | Main Features | Application Cases |
Laboratory Basic Spin Coater | Designed to meet the basic research needs of university laboratories and research institutions, it is suitable for spin-coating experiments of conventional photoresist, polymer solutions and functional coatings. |
Single-station structure with simple operation Supports basic speed and time control Vacuum adsorption for sample fixing Suitable for small-size substrates and non-standard samples
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Photolithography process teaching and basic experiments Preparation of transfer auxiliary layers for 2D materials Process exploration of new material thin films
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Multi-program Precision Spin Coater |
Suitable for refined process development and scientific research applications with high repeatability requirements, supporting complex spin coating processes.
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Editable multi-stage speed and time programs Supports combined process of low-speed spreading and high-speed spin coating High speed stability and excellent film thickness uniformity Compatible with materials of various viscosities
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Pre-treatment for micro-nano device fabrication Multi-layer thin film preparation process R&D of MEMS, sensors and functional devices
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Wafer-Level Spin Coater | Suitable for wafer-level sample processing and pilot-scale verification, it meets the consistent spin-coating requirements for large-size substrates. |
Supports wafer-level substrate spin coating High-stability speed control system Optimized chamber structure to reduce edge effects Suitable for continuous repeated experiments and small-batch production processes
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Customized Extended Spin Coater | A customized model for special materials, special substrate shapes and automation requirements. |
Customizable substrate size and clamping method Compatible with special solutions and process requirements Expandable with online heating, baking and automatic sample loading functions Suitable for integration into experimental platforms or production lines
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Research on special functional thin films Processing of irregular samples and flexible substrates Integration of automatic or semi-automatic experimental systems
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Appearance Drawing
