I. Product Overview
The ABN-VEGA tungsten filament scanning electron microscope represents the 4th-generation product. Equipped with a unique objective-aperture-free column, it delivers ultra-wide field-of-view, high-resolution imaging with large depth of field. With further optimized electron beam parameters, it achieves optimal imaging observation and analytical performance.
The Essence™ operating software integrates SEM imaging and real-time elemental analysis. This combination greatly streamlines the acquisition of morphological and elemental data from samples, delivering highly efficient analytical solutions for quality control, failure analysis, and routine laboratory material inspection. The innovative Essence™ 3D vacuum function ensures stable collection efficiency of detectors inside the specimen chamber during sample movement.
A tungsten filament scanning electron microscope uses a thermionic tungsten filament as its electron source. This type of SEM features a mature structure, stable operation and low maintenance cost. It is one of the most widely used electron microscopy instruments in materials science, metallurgy, semiconductor industry, electronic manufacturing, as well as university teaching experiments. The instrument focuses an electron beam to scan the sample surface point-by-point, and simultaneously collects signals including secondary electrons and backscattered electrons, to realize high-resolution imaging of surface morphology and compositional differences of specimens.
Basic Parameters & Configuration
SE Resolution: 3 nm at 30 kV, 8 nm at 3 kV
Extra-large observation field of view, up to 50 mm maximum
Excellent low-magnification performance, facilitating observation and positioning of large-sized samples
Fully integrated Essence™ EDS function enables quick and easy switching from imaging to elemental analysis
Fitted with multiple differential pressure valves. One-click switching from high vacuum to SingleVac™ low-vacuum mode, supporting observation of large samples under low-vacuum conditions
II. Functional Features
Adopts a high-stability tungsten filament electron gun with long service life and easy replacement.
Diverse imaging modes: supports Secondary Electron (SE) and Backscattered Electron (BSE) imaging.
The resolution meets the observation requirements from micron to submicron scale.
Wide sample compatibility, applicable to metals, ceramics, polymers and composite materials.
User-friendly operation interface, ideal for scientific research, testing and teaching applications.
Expandable with Energy Dispersive Spectroscopy (EDS) system to realize micro-area composition analysis.
III. Application Scenarios and Fields
• Materials Science: Analysis of metal microstructures, ceramic microstructures and composite material interfaces;
• Semiconductor & Electronic Manufacturing: Morphology observation of solder joints, inspection of packaging defects and circuit fracture analysis;
• Industrial Inspection: Failure analysis, surface defect detection and quality control;
• Geology & Mineralogy: Mineral morphology observation and phase composition analysis;
• Teaching & Scientific Research: Experimental teaching for materials, physics and electronic engineering in universities.
IV. Technical Advantages
Mature and reliable technology: The tungsten filament electron gun has a simple structure and stable long-term operation.
Low operating cost: The filament is low-priced, and maintenance & running expenses are manageable.
Less stringent requirements for the vacuum system, suitable for conventional laboratory environments.
High tolerance to sample contamination and operational errors.
Perfect for routine observation and high-throughput sample testing.
V. Typical Models and Application Cases
type | positioning | Features | Application Cases | Applicable Objects |
T-SEM100｜Standard scientific research tungsten filamentSEM | Conventional Scientific Research and Material Characterization |
· Tungsten filament thermionic electron gun · Resolution: ≤5 nm (typical value) · Acceleration voltage range: 0.5–30 kV · Secondary electron (SE) imaging as the primary mode · Conventional high vacuum mode supported
|
· Analysis of grain structure and fracture morphology of metallic materials
· Observation of surface morphology of polymers and composite materials
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· Universities and research institutes
· Materials and Physics Laboratory
· Routine morphology observation requirements
|
T-SEM200｜Analytical Extended Tungsten Filament SEM | Comprehensive Analysis of Morphology and Composition |
· High-stability tungsten filament electron gun · Resolution: ≤4 nm · Reserved expansion interfaces for EDS / BSE · Multi-detector coordinated imaging capability · Superior stability compared with the basic model
|
· Analysis of Solder Joints and Packaging Defects of Electronic Devices
· Microstructure Analysis of Inorganic Materials and Ceramics
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· Materials Analysis Laboratory
· Semiconductor Packaging and Electronic Manufacturing
· Industrial Quality Inspection Department
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T-SEM300｜Industrial Inspection Type with Large Sample Chamber | Industrial Inspection and Failure Analysis |
· Enlarged sample chamber structure · Compatible with irregular and large-volume samples · Highly durable mechanical structure · Strong anti-contamination performance
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· Surface Defect Inspection of Industrial Components
· Coating and Surface Treatment Process Evaluation
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· On-site industrial inspection · Surface analysis of mechanical parts · Production line quality control
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T-SEM Edu｜Special Teaching Model | Teaching and Basic Experiments |
· Simplify system structure · Stable, secure and easy to maintain · Suitable for frequent power on and off · Intuitive operation logic
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· Teaching Experiment on the Principle of Scanning Electron Microscopy Imaging · Basic Training for Microscopic Observation of Materials
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· Undergraduate Teaching Laboratories of Universities · Training Centers for Vocational Colleges · Teaching of Microscopic Imaging Principles
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