The Ebner MA Series Semiconductor/FPD Inspection Microscope is a high-performance microscopic observation and analysis platform developed by Ebner Micro-Nano Technology for integrated circuit manufacturing, display panel production and precision manufacturing quality inspection. Built on high-resolution optical design, precision mechanical structure and a stable imaging system, the system focuses on visual observation and analysis for key process links including chip packaging, line width/line spacing, defect judgment, solder joint inspection, and pixel structure inspection of OLED/PDP/IPS panels. This series is suitable for semiconductor wafer inspection, packaging substrate inspection, FPD panel microstructure observation, PCB/PCB interlayer observation, and other industrial sites requiring high-contrast, high-resolution microscopic inspection.
I. Core Advantages
High-Resolution Optical Imaging
Adopts optical components with high light transmittance and high resolving power, suitable for microstructure observation and detail identification.
Industrial-Grade Stable Platform
Precision guide rails paired with a rigid frame enable long-time observation with low drift.
Multiple Lighting Combinations
Compatible with various industrial lighting modes including transmitted, reflected, coaxial and dark-field lighting to enhance defect contrast.
Scalable Digital Imaging Solution
Works with industrial cameras and image analysis software to realize image capture, measurement, recording and report generation.
Tailored for Manufacturing Site Requirements
Designed for easy operation, low daily maintenance and strong environmental adaptability.
II. Technical Specifications (Typical Configuration)
1) Optical System
Optical System: Industrial infinity-corrected or telecentric optical solution (as configured); Optical layout: Upright / side view optional (depending on application); Imaging mode: Visual observation / digital imaging
2) Objective Lenses and Magnification: Objective magnification (optional): 1× / 2× / 5× / 10× / 20× / 50× / 100× (selectable on demand); Working distance: Long working distance objectives, compatible with thick workpieces; Total magnification: 20×–1000× (subject to configuration and camera)
3) Stage
Type: Industrial precision mechanical stage (manual / motorized optional)
Typical travel range: X-axis: ≥ 200 / 300 / 500 mm; Y-axis: ≥ 100 / 200 / 300 mm, Repositioning accuracy: ≤ 2 µm (with high-precision encoder feedback)
4) Focusing System
High-precision coaxial coarse / fine focusing handwheel; Minimum fine graduation: ≤ 1 µm; Anti-collision limit mechanism
5) Illumination System
Transmitted illumination: High-brightness bottom LED light source; Reflected illumination: High-brightness industrial ring LED; Coaxial illumination: Optional (improves contrast of flat reflective parts); Darkfield illumination: Optional (enhances defect contrast); Light brightness: Continuously adjustable
6) Digital Imaging System (Optional)
Industrial camera interface: USB3.0 / GigE / CameraLink
Resolution: ≥ 5 MP / 10 MP / 20 MP optional
Software functions: Real-time display / capture, basic measurement, annotation, zoom and stitching, comment and report export
7) Auxiliary Functions and Accessories (Optional) Side-view lens / tilt lens; Tube projection device; Air blow cleaning device; Dimension calibration standard slide; Ambient light isolation cover (to reduce interference)
8) Electrical and Environmental Conditions
Power supply: AC 100–240 V, 50/60 Hz; Operating temperature: 15–35 ℃; Relative humidity: 20%–80% (non-condensing)
III. Typical Application Fields
Semiconductor manufacturing process inspection: Observation of wafer cracks, scratches, particles and photolithography defects; Inspection of solder joints/leads on packaging substrates.
FPD (Flat Panel Display) structural inspection: TFT/pixel structure, thin film layer edges, printing defects, pixel pitch inspection.
PCB quality inspection: Pad/via observation, trace width/spacing, solder mask defect judgment.
Micro-nano fabrication product observation: Detailed inspection of MEMS structures, microchannels, micropore arrays, etc.
Precision mechanical component inspection: Inspection of tiny holes, engraved lines, chamfers, surface defects and more.
Angle-adjustable observation tube
