The Ebone N-series industrial infrared microscopy system is an integrated infrared microscopy platform developed by Ebone Micro-Nano Technology for high-end applications including industrial inspection, non-destructive analysis, infrared spectroscopy, material characterization and microstructure thermal imaging. Integrating high-sensitivity infrared imaging, precision microscopic optics, computer-controlled inspection and analysis software, the system features high spatial resolution, high-contrast imaging and spectral analysis capabilities. It is applicable to a variety of industrial scenarios such as materials science, semiconductor packaging, microelectronics manufacturing, nanomaterials and failure analysis. Leveraging the detection capability of infrared light for the transmission, reflection and absorption properties of materials, the N-series provides users with an industrial-grade infrared microscopy solution combining visualization, quantitative analysis and report generation.
1. Product Features
High-sensitivity infrared imaging capability: Adopts high-performance infrared detectors, covering the mid-wave infrared (MWIR) or long-wave infrared (LWIR) bands, and enabling detection and visualization of micro-optical properties of materials.
Industrial-grade stable structure: Features precision mechanical construction and thermal stability design, suitable for long-duration and repetitive measurements.
Expandable spectral analysis interface: Optional FT-IR or spectrometer modules can be equipped to realize integrated spatial and spectral analysis.
Modular hardware and software platform: Supports image acquisition, auto-focusing, temperature mapping, quantitative analysis and report generation.
Applicable to a wide range of industrial inspection requirements: including thermal response of microstructures, observation of material defects, interlayer structure inspection, stress/strain distribution analysis, etc.
II. Technical Specifications
1) Infrared Imaging Optical System
Type: Special infrared microscopic imaging system
Wavelength range:
Mid-wave infrared (MWIR) 3–5 μm; Long-wave infrared (LWIR) 8–12 μm; (selectable according to detector configuration); Imaging mode: Reflective / transmissive (optional); Field of view: Matched based on objective lens and detector; Optical interface: Standard C / F extension interface (depending on lens and detector configuration)
2) Infrared Detector
Detector type:
InSb (MWIR) high-sensitivity detector; VOx / microbolometer (LWIR) industrial infrared detector; Pixel resolution: 640×512, 1280×1024, 1920×1080 (optional); Pixel size: ≤ 15 μm (typical); Sensitivity (NETD): ≤ 50 mK (LWIR); High-sensitivity InSb (MWIR)
3) Optical Lens
Infrared objective magnification: 5× / 10× / 20× / 50× (optional); Telecentric lens combination available to reduce distortion and field-of-view error; Working distance: Subject to lens specifications (typically greater than 10–20 mm)
4) Motorized Stage and Precision Positioning
X–Y manual / motorized stage; Typical travel range: 200×150 mm / 300×200 mm; Repositioning accuracy: ≤ 5 μm (typical); Z-axis focusing: Motorized / manual optional
5) Infrared Illumination System
Stable infrared light source: Adjustable infrared fill light; White light visible co-illumination optional for assisted focusing and comparative observation; Continuously adjustable light intensity
6) Software and Analysis Functions
Real-time infrared image display; False-color rendering, temperature mapping (for thermal response imaging); Autofocus and image enhancement; Area/point temperature statistics and curve analysis; Image overlay and comparison, defect annotation; Data export: TIFF, PNG, CSV, temperature report
7) Data Interface
Interface type: USB3.0 / GigE / CameraLink (depending on detector); Real-time image transmission and control; Network deployment available, remote control supported (optional)
8) Electrical and Environmental Conditions
Power supply: AC 100–240 V, 50/60 Hz; Operating temperature: 10–35 ℃; Relative humidity: ≤ 80% (non-condensing)
III. Typical Application Fields
Analysis and imaging of thermal response distribution of microstructures; local thermal deformation detection of semiconductor packaging and PCB; observation of interlayer structures, defects and impurities of materials; structural inspection of microelectronics and micro-electro-mechanical systems (MEMS); analysis of local inhomogeneity of FPD / OLED panels; performance characterization and thermal field mapping of thermoelectric materials
Before Image Anti-Reflection vs After Image Anti-Reflection
