The UN-U150 150 kV microfocus X-ray source, independently developed by Abner, is designed for high-resolution X-ray imaging, non-destructive testing of microstructures and research-grade material characterization applications. Adopting a highly stable electron optical design and microfocus target structure, this product delivers micron-level spatial resolution while maintaining strong penetration capability. It is suitable for high-end application scenarios including X-ray CT, micron/submicron defect inspection, semiconductor package inspection, and internal material structure analysis. The UN-U150 has undergone system-level optimization in structural reliability, thermal stability and long-term operational consistency. It can serve as the core radiation source module for desktop microfocus CT systems, in-line inspection systems and customized X-ray analysis platforms.
I. Product Features and Advantages
1. 150 kV high-voltage platform, balancing resolution and penetration power
The maximum tube voltage reaches 150 kV, suitable for high-density materials and samples with complex structures. While maintaining a micro-focus size, it achieves excellent imaging contrast and signal-to-noise ratio, supporting multi-scenario applications ranging from low-Z materials to medium and high-Z alloys and packaging structures.
2. Micro-focus design enabling high-resolution imaging
It adopts a precision electron beam focusing system. The focal spot size can reach the micrometer scale (μm level). It significantly improves spatial resolution under geometric magnification and is suitable for micro-defect inspection.
3. Highly stable electron optical system
Integrated design of high-voltage module, filament power supply and beam current control system. It features low tube current fluctuation and good repeatability during long-term operation, ideal for long-duration continuous work scenarios such as CT scanning.
4. Efficient heat dissipation and optimized target structure
Coordinated design of target material and heat dissipation structure. It effectively reduces the impact of thermal drift on focal spot size and beam current stability, extending the service life and operational reliability of the X-ray source.
5. Modular interface for easy system integration
Supports multiple system integration methods (CT, inspection lines, experimental platforms). It can be deeply adapted to Aibona's self-developed X-ray imaging systems and precision motion platforms, and supports customized interfaces and control protocols.
II. Typical Application Fields
Micro-focus X-ray CT system; semiconductor packaging / chip solder joint / TSV inspection; non-destructive testing of precision electronic devices; internal defect analysis of metals and composite materials; research-grade material structure characterization; new energy battery and micro-structure device inspection
III. Technical Specifications
1. X-ray Tube Parameters
Maximum tube current
| Parameter Item | Technical Indicators |
|---|
| Model | UN-U150 |
| Tube voltage range | 30 – 150 kV |
| ≤ 500 μA（Typical value, depends on focus mode） |
|
| Maximum output power | ≤ 75 W（According to the working mode） |
| Focus Type | microfocus |
| Minimum focal spot size | Micron scale (μm order of magnitude, typically ≤ 5 μm) |
| target material | Tungsten (W) or custom options available |
| target angle | Optimized Design (Typical 10°–20°) |
2. Imaging and Stability Indicators
Tube current stabilityFocus drift
| Parameter Item | Technical Indicators |
|---|
| Tube voltage stability | ≤ ±0.1% |
| ≤ ±0.5% |
|
| ≤μm (long-term stable operation) |
|
| Startup time | < 5 min（Reach a stable working state） |
3. Cooling and Structure
| Parameter Item | Technical Indicators |
|---|
| Cooling method | Forced air cooling / Optional liquid cooling |
| Continuous working capability | Supports long-term continuous operation |
| protective structure | Integrated X-ray shielding design |
| Safety interlock | Multiple interlock protection (access control / temperature control / high voltage) |
4. Electrical and Control Interface
| Parameter Item | Technical Indicators |
|---|
| High-voltage power supply | Integrated design with built-in or external configuration |
| 控制方式 | Local / Remote Control |
| 通讯接口 | Ethernet / RS-232（Customizable) |
| 软件支持 | Windows Platform supporting secondary development |
5.Installation and Environment Requirements
Installation MethodMeet the standard
| Parameter Item | Technical Indicators |
|---|
| Operating ambient temperature | 10 – 30 °C |
| Relative humidity | ≤ 70%（No condensation） |
| System-integrated / Custom Bracket |
|
| GB / IEC X Standards Related to Radiation Safety |
|
Detection effect diagram:
