1. Product Overview
As a mass-produced model of the ABN series, the UN-160 is a representative domestic high-end open-tube X-ray source. Its core advantages include a nanoscale focal spot (0.8μm), high penetration up to 160kV and digital intelligent control. It addresses the challenges of high-precision inspection for high-end products such as wafers, advanced packages and multi-layer stacked chips, and drives domestic high-end X-ray sources from technological breakthroughs toward large-scale application.
II. Equipment Specifications
| Parameter Category | Specific parameters |
|---|
| focal spot size | 0.8μm（JIMA standard） |
| Tube voltage | 20kV - 160kV（adjustable） |
| Tube current | 0-200μA（Typical value） |
| Maximum output power | Approx. 8W (typical value) |
| Ray cone angle | ≥150° |
| Minimum Focus - Object Distance（FOD） | 0.25mm（Reference value） |
| Geometric magnification | 可达 2800X（Reference value） |
| target material | Tungsten Target (Standard Configuration) |
| Cooling method | Oil cooling / Forced air cooling (integrated type) |
| control system | Digital intelligent control, supporting remote/local operation |
| interface | RS - 232 / Ethernet (for data exchange and control) |
| Work environment | Temperature: 10-35℃, Humidity ≤70% (no condensation) |
III. Product Features
Nano-scale focal imaging: 0.8μm focal spot size achieves sub-micron resolution, enabling clear capture of tiny defects and fine structures.
High penetration capability: Maximum tube voltage of 160kV delivers strong penetration for high-density and thick materials (such as multi-layer PCBs, semiconductor packages and metal castings), suitable for high-end inspection scenarios.
Advantages of open structure: Replaceable components with low maintenance cost and controllable service life; large radiation cone angle (≥150°), meeting inspection requirements for large field of view and high magnification.
Digital intelligent control: Integrated high-precision high-voltage power supply and digital control system. The regulation accuracy of voltage/current reaches 0.1kV/μA level. It supports parameter storage, automatic fault diagnosis and remote monitoring for efficient and stable operation.
Integrated design: Integrated high-voltage generator, X-ray tube and heat dissipation system, featuring compact size for integrated installation in industrial CT, AOI inspection equipment and other devices.
IV. Technical Advantages
Focus Control Technology: The electron optical system achieves precise focusing with a high focal stability of 0.8 μm and long-term working drift ≤0.1 μm, ensuring consistent imaging performance.
High Voltage Stability: Adopting a high-frequency inverter high-voltage power supply with voltage ripple ≤0.5%, it reduces imaging noise and improves defect recognition rate.
Vacuum and Lifespan Management: A combined high-low vacuum system maintains long-term vacuum stability at the level of 10⁻⁷ Pa to extend the service life of cathodes and target materials. Its open structure allows replacement of filaments and target materials, enabling an "infinite lifespan" maintenance mode.
Intelligent Operation and Maintenance: It monitors parameters such as tube voltage, tube current, temperature and vacuum level in real time. Automatic protection and early warning will be triggered upon abnormalities to reduce downtime risks and improve equipment availability.
Domestic Independence and Controllability: Core components are independently developed to break import monopolies. It features short delivery cycles and rapid after-sales response, catering to customized demands of domestic industries including semiconductors and electronics manufacturing.
V. Application Scenarios and Fields
Semiconductor and Microelectronics Manufacturing
Wafer Fabrication: Detection of surface particles, scratches and interlayer defects on wafers with 28nm and below process nodes, full-wafer scanning and defect localization.
Advanced Packaging: 2.5D/3D packaging, inspection of TSV through-silicon via filling integrity, microbump soldering quality, and gold wire / copper wire bonding.
Power Devices: Inspection of internal structures and solder joints in thick-layer packages such as IGBTs and MOSFETs to ensure reliability under high power conditions.
Electronics Manufacturing
High-end PCB/PCBA: Inspection of blind/buried hole conductivity, inner-layer short circuits/open circuits, and voids and bridging in BGA/CSP package solder joints for multi-layer boards (more than 12 layers).
Automotive Electronics: Non-destructive testing of new energy vehicle power modules, ADAS sensors (such as LiDAR PCBs), and automotive-grade chip packages to guarantee driving safety.
Industrial Non-Destructive Testing (NDT)
Precision Casting: Detection of internal pores, cracks and shrinkage cavities in small precision castings including aero-engine blades and medical implants (such as titanium alloy stents).
Composite Materials: Inspection of interlayer delamination and porosity of carbon fiber-reinforced plastics (CFRP) and honeycomb structures, suitable for quality control of lightweight materials in the aerospace industry.
Scientific Research and Laboratories
Materials Science: Microstructure analysis of nanomaterials, thin films and battery electrodes, combined application of X-ray diffraction (XRD) and microscopic imaging.
Life Science: Small animal imaging and structural observation of biological samples (such as tissue sections), providing high-resolution imaging support for basic research.
Other High-End Inspection
Medical Devices: Inspection of packaging sealing performance and internal component assembly of implantable medical devices (such as pacemakers and artificial joints).
New Energy Batteries: Inspection of lithium battery tab welding, cell internal structures and separator defects to improve battery safety and cycle life.
Work imaging diagram
