1. Product Overview

The ABNONA Plasma Cleaner (ABN-PCM-001) is an advanced equipment for surface cleaning treatment, applicable to surface cleaning of a variety of materials. It works on the principle of plasma action to clean material surfaces and efficiently remove contaminants such as organic substances and oxides. The cleaning process can be completed at low temperature to avoid damage to materials.

2. Functional Features

1. High-efficiency Cleaning: It realizes non-destructive cleaning at the nanometer level, eliminating residues and damages caused by traditional wet cleaning.

2. Surface Activation: It greatly improves the surface energy of materials and optimizes the consistency of subsequent processes such as coating, bonding and cladding.

3. Controllable Process: Parameters including power, gas type and treatment time can be precisely adjusted with high repeatability.

4. Wide Compatibility: Compatible with various substrates such as metals, semiconductors, glass and polymer materials.

5. Eco-friendly & Safe: No chemical solvents required, reducing pollution and waste liquid disposal costs.

3. Application Scenarios & Fields

• Semiconductor & Microelectronics: Wafer cleaning, pre-photolithography treatment, surface activation before packaging.

• Optics & Precision Manufacturing: Pre-coating treatment for lenses, optical filters and optical components.

• Biomedical Industry: Surface modification of medical implants, petri dishes and chip experimental vessels.

• New Materials & Scientific Research: Research on two-dimensional materials, flexible electronics and functional thin films.

• Industrial Manufacturing: Surface treatment of plastic parts before spraying and bonding.

4. Technical Advantages

1. Low-temperature Treatment: Suitable for temperature-sensitive materials without causing thermal damage.

2. Excellent Treatment Uniformity: Stable plasma distribution, ideal for large-area samples and complex structural parts.

3. Wide Process Window: Supports multiple process modes including cleaning, etching, activation and surface modification.

4. Stable and Reliable System: Capable of long-term continuous operation with low maintenance costs.

5. Strong Scalability: Configurable with RF, microwave or atmospheric plasma sources as required.

5. Typical Models & Application Cases

VI. Technical Parameters

1. Visual touch screen: Real-time monitoring of process parameters.

2. Gas types: Supports argon, oxygen, hydrogen, nitrogen and fluorinated gas.

3. Gas channels: Equipped with dual-channel process gas.

4. Flow control: Dual gas flow control with adjustable proportion.

5. Precision: High-precision flow monitoring system.

General Laboratory Plasma Cleaner (Mini Type)

Semiconductor & Micro-nano Processing Plasma Cleaner (Medium Size)

Industrial Automatic Plasma Cleaning System (Large Size)