Ⅰ. Product Overview

The fully automatic wafer transfer stage is a high-precision automatic transfer equipment designed for semiconductor manufacturing, micro-nano processing and advanced material research. It is mainly used for accurate handling, positioning and alignment of wafers between different process stations.

Compatible with 2–8 inch wafers, the equipment realizes full-process automation of wafer transfer via multi-axis precision motion control, automatic alignment algorithms and vacuum adsorption mechanisms. It effectively reduces manual intervention, and improves process consistency and production efficiency.

This system is widely applicable to photolithography, coating, etching, inspection and integrated transfer processes, and is especially suitable for research platforms, pilot production lines and small-batch semiconductor device fabrication scenarios.

Technical Parameters

1. 2D Material Transfer FunctionTravel range: ±25mm (X-axis), ±25mm (Y-axis)Max observation area: 0–16mm (vertical direction), observation range: 0–20mm

2. Motor ControlMotor control system: 24V motor control system, equipped with DC motor and motor drive moduleAccuracy: Step accuracy ≤2μm, positioning accuracy ≤0.1mm

3. Wafer Handling & PositioningMax sample load weight: ≤4 kgMax object loading height: 0–160mm (adaptable range)

4. Heating SystemCompatible with TCM heating platform, maximum heating temperature: 350°C

5. Control SystemCompatible with Windows operating system, equipped with USB interface and RS-232 communication portPower input: 24V DC, 250W

6. Operation & Control ModeAdopts touch screen control panel, supports manual/automatic mode switchingSupported software: LabVIEW, PLC control, X-BOX remote control

7. Environmental RequirementsOperating temperature: 0°C ~ +80°COperating humidity: ≤80% RH

II. Functional Features

1. Fully automatic multi-axis motion control: Integrated X/Y/Z/θ multi-degree-of-freedom electric platform to realize high-precision positioning and repetitive transfer of wafers.

2. Vacuum suction wafer clamping mechanism: Adopts uniform negative pressure adsorption to ensure stability and safety of wafers during transfer.

3. Automatic alignment and positioning function: Supports automatic alignment based on optical marks or edge recognition to improve transfer accuracy.

4. Compatible with multi-size wafers: Applicable to 2–8 inch wafers with quickly replaceable fixtures and suction modules.

5. Centralized software control: Realizes path planning, parameter setting and one-click operation via upper computer software.

6. Safety interlock and fault protection: Equipped with vacuum, motion and limit protection mechanisms to ensure stable equipment operation.

III. Application Scenarios & Fields

1. Automatic transfer of semiconductor wafers among photolithography, coating and etching processes;

2. Automatic wafer processing on micro-nano processing experimental platforms;

3. Large-scale wafer-level transfer and integration of 2D materials and advanced materials;

4. Construction of automatic experimental platforms in research institutes and universities;

5. Wafer handling and positioning for pilot lines and small-batch production.

IV. Technical Advantages

1. High degree of automation greatly improves process consistency and stability.Coordinated operation of multi-axis electric platform and software system enables full-process automatic wafer transfer, effectively eliminating uncertainties caused by manual intervention. It is ideal for scientific research and pilot trial scenarios with high requirements on process repeatability.

2. Combination of high-precision motion control and automatic alignment guarantees superior wafer transfer accuracy.The system integrates X/Y/Z/θ multi-degree-of-freedom motion mechanisms, and is compatible with optical alignment and edge recognition algorithms to ensure precise position and angle matching of wafers during multi-process transfer.

3. Proven and reliable vacuum adsorption ensures safe wafer handling.The uniform negative-pressure vacuum adsorption structure effectively avoids stress concentration, scratches and contamination risks caused by mechanical clamping, enabling stable transfer of wafers of various sizes.

4. Modular structure facilitates system integration and function expansion.Each functional unit is independently designed for flexible configuration and upgrade according to actual demands, supporting seamless system-level integration with photolithography, coating, etching and inspection equipment.

5. Dual applicability for scientific research and pilot production with wide application coverage.The equipment is designed to balance experimental flexibility and long-term stable operation, providing solid support for the transformation of scientific research achievements into engineering and practical applications.

6. Centralized software control and safety interlock design enhance overall system operational reliability.Upper computer software realizes process management and real-time status monitoring. Equipped with multi-level safety protection mechanisms, it fully ensures the safety of both equipment and wafers during long-term continuous operation.

V. Typical Application Examples

Wafer-level Material Transfer/Integration

Equipment Appearance Drawing