Dimensions: 60 cm × 60 cm, compatible with various testing requirementsEquipped with high-definition industrial CCD, supporting long focal magnifications of 5X, 10X, 20X and 50X
Fitted with three-axis high-precision CCD (replaceable to fit diverse optical configurations)Microscope system standard configuration: integrated ring light and backlight illumination system for clear imaging
Lifting stage: Electric lifting with adjustable travel speed (0.02–4 mm/s)
XY axes: Electric adjustment, 50 mm × 50 mm control range, 360° rotation supported
Z axis: Electric adjustment with a maximum travel of 200 mm
Maximum sample dimension: 65 mm × 65 mm, suitable for most materials and sample typesMaximum sample weight: 4 kg
Supports XBOX controller and software control to streamline operation proceduresElectric control: Switchable between automatic and manual modes to meet diverse experimental demands
Temperature range: 0°C to 40°CHumidity range: ≤80% RH
Comes with a high-definition display (780 mm × 600 mm) for real-time data monitoring and visualizationMultiple software functions available to improve testing accuracy and flexibility

Fully automatic XYZ multi-axis electric stage enables precise positioning and repeatable movement of probes and samples.
Automatic probe contact and lift control reduces interference of manual operation on test results.
High-stability probe holder system supports synchronous testing with multiple probes.
Coaxial alignment via microscopic observation system for accurate identification of test areas.
Centralized software control and parameter management support automated test procedures.
Multi-stage safety interlock and limit protection ensure the safety of equipment and samples.
I-V, C-V and reliability testing of semiconductor devices
Functional and contact performance testing of MEMS devices
Electrical transport and device performance research of two-dimensional material devices
Construction of automated test platforms for universities and research institutes
Repeatability verification and parameter statistics of novel device processes
High automation level greatly improves test efficiency and data consistency. The coordinated operation of the electric stage and software enables automatic execution of test procedures, eliminating uncertainties caused by manual operation, and is suitable for mass testing and statistical analysis.
High-precision motion control and stable contact mechanism guarantee test reliability. The system integrates high-resolution motion control and fine contact adjustment functions to maintain stable contact between probes and device electrodes.
Coordination of microscopic observation and automatic alignment enhances test accuracy. Combined with microscopic imaging and automatic alignment algorithms, the system achieves precise positioning of tiny test areas.
Compatibility with multi-probe and multiple configurations delivers a wide range of applications. It supports multi-probe layout and various test setups to meet diverse device structures and testing requirements.
Powerful centralized software control and data management. Test procedures, parameters and results can be managed uniformly, facilitating sorting and traceability of research data.
Suitable for long-term stable operation in scientific research and pilot production stages. The equipment design balances flexibility and long-running stability, providing a reliable platform for research and engineering testing.
Application Type | Test object | Key Functions | Test content | Application Directions | Remarks |
Automatic Testing of Semiconductor Devices | Chip / Electrode Structure | Automatic alignment and stable contact | I-V、C-V Test | Device R&D | High repeatability |
MEMSDevice Testing | Microstructure Devices | Multi-probe Configuration | Function and Contact Test | Micro-nano Research | Automated Testing |
Two-dimensional Material Device Testing | Graphene / TMDs | Multi-probe Configuration | electrical transport properties | Materials Research | Commonly used in scientific research |
Construction of Automation Platform | Standard sample | Centralized Software Control | Batch testing | Universities / Research Institutes | Efficiency improvement |
Note: The above configurations can be customized and adjusted according to users' experimental requirements.
MEMS Automated Device Testing

Equipment appearance drawing


Company Address:
Huai'an (Headquarters): No. 7, Meigao Road, Qingpu Industrial Park, Qingjiangpu District, Huai'an City, Jiangsu Province
Suzhou: 4th Floor, Building D, China-Netherlands Innovation Harbor, No. 588 Xiangrong Road, Beihejing Sub-district, Xiangcheng District, Suzhou City, Jiangsu Province
Email:service@abner-nano.com
Contact Number: 13327968688 Mr. Yan

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