I. Product Overview

UV Litho-ABN Pro+ Maskless Lithography System is a micro-nano processing device based on digital light field modulation technology. It directly generates exposure patterns via DMD (Digital Micromirror Device) or SLM (Spatial Light Modulator), and projects designed patterns in real time onto the photoresist-coated substrate without physical photomasks, enabling rapid and flexible fabrication of micro-nano structures.

This equipment is specially designed for research institutes, university laboratories and pilot verification applications. It greatly reduces photomask fabrication costs and shortens process iteration cycles, serving as an essential tool for advanced micro-nano manufacturing and prototype development.

II. Functional Features

1. Mask-free exposure: Adopts digital direct-writing mode, allowing immediate exposure after pattern modification.

2. Highly flexible pattern design: Supports CAD/GDS file import and online editing.

3. High-precision motion and alignment system: Precise X/Y/θ adjustment to meet multi-layer alignment requirements.

4. Multi-wavelength exposure light source: Compatible with UV bands including 365 nm and 405 nm.

5. Compatibility with substrates of various sizes: Supports 2–6 inch wafers, glass and flexible substrates.

6. Precise exposure dose control: Grayscale exposure and adjustable light energy are available.

7. Highly integrated software: Supports storage, recall and streamlined operation of process parameters.

8. Comprehensive safety protection design: Equipped with light source shielding, safety interlocks and alarm functions.

III. Application Scenarios & Fields

1. Prototype design and rapid verification of micro-nano devices

2. Fabrication of two-dimensional material devices and electrode structures

3. Rapid iterative development of MEMS structures

4. Prototyping of microfluidic chips

5. Research on optical microstructures and diffractive devices

6. Teaching experiments and research process exploration

IV. Technical Advantages

1. Adopting digital direct-write exposure technology, the system eliminates the need for traditional lithography masks. It avoids the high costs generated by mask design, fabrication and revision, making it ideal for micro-nano structure designs with frequent iterations in the R&D stage.

2. Pattern design and exposure are highly integrated. Design files can be directly used for exposure, cutting down intermediate procedures and drastically shortening the overall cycle from schematic design to sample fabrication.

3. It flexibly realizes exposure of arbitrary-shaped, aperiodic and gradient structures, breaking the limitations of conventional mask lithography in pattern complexity and design freedom, and satisfying the processing requirements of innovative devices and novel structures.

4. The system delivers high-precision alignment and position control, supporting accurate overlay exposure of multi-layer patterns with stable repeatability, suitable for micro-nano device fabrication involving multiple process steps.

5. The exposure unit, motion stage and control software are highly integrated, featuring a user-friendly interface and straightforward workflows, which lowers the operation threshold and allows researchers and engineers to get started quickly.

6. Benefiting from mask-free operation, flexible processes and rapid parameter adjustment, this maskless lithography system is perfectly suited for small-batch, multi-variety and customized micro-nano processing tasks, and boasts outstanding application value for scientific research and pilot production.

V. Technical Specifications

1. Operating Wavelength: 405 nm

2. Laser PowerMaximum Power: 300 mW

3. ResolutionMinimum Resolution: 0.3 μm

4. Alignment AccuracyFront Side: 0.1 μm (within 1 mm area), Side Side: 1 μm (2.5 μm)

5. Scanning Speed: 3–150 mm²/min

6. Chuck Size: Max. 8 inches

 Product Features

Flexible Design: No photomasks required; patterns can be modified rapidly, ideal for prototyping and customization.

High Resolution: Enables precision photolithography ranging from micrometer to nanometer scale.

Efficient Workflow: Cuts down processing cycle time and boosts manufacturing productivity.

Multi-material Compatibility: Compatible with various materials including semiconductors and polymers.

Low Cost: Eliminates photomask fabrication expenses, perfect for research & development and low-volume production.

Wide Application Coverage: Deployed in the manufacturing of microelectronics, MEMS, optical devices and other fields.

VI. Typical Cases and Application Examples

Note: The above configurations can be customized and adjusted according to users' experimental requirements.

Appearance drawing