I. Product Overview

The ABN PCB Probe Station is core precision test equipment for the R&D, production and inspection stages of printed circuit boards (PCBs). It utilizes micro-level precisely positioned probes to contact test points including PCB pads, vias and pins, enabling electrical performance inspection, functional verification and fault localization. It caters to full-process PCB testing requirements ranging from R&D prototyping to mass production quality inspection, and is categorized into manual, semi-automatic and fully automatic models based on automation level, making it essential equipment for electronic manufacturing, microelectronics R&D and circuit board maintenance.

Centered on a precision positioning system and customizable probe modules, the PCB probe station is equipped with optical alignment and signal transmission modules to achieve accurate contact with test points on PCBs of various specifications and processes, including rigid PCBs, flexible printed circuits (FPC), rigid-flex boards, HDI boards and packaging substrates. Paired with external instruments such as source meters, oscilloscopes, network analyzers and ICT test systems, it conducts multi-dimensional measurements covering DC parameters, AC characteristics, high-frequency RF performance and connectivity.

The equipment supports fine pads and vias with dimensions above 0.1 mm, delivers positioning accuracy up to ±1 μm, and accommodates single-sided and double-sided testing. It can handle large-format PCBs with maximum dimensions of 610×500 mm. Certain high-end models can be integrated with automatic loading/unloading and data traceability systems to seamlessly connect to electronic production lines, balancing the flexibility required for laboratory R&D and the high efficiency demanded by mass production testing.

II. Main Technical Specifications

• Maximum positioning accuracy up to ±1 μm; adopts full closed-loop motion control system to realize high-precision, high-efficiency and high-robustness positioning movement.

• Minimum index time down to 240 ms; marble base and high-rigidity structure enable high-load, low-vibration motion with fast settling time.

• Maximum lifting force of 750 kgf; integrated four-corner support for Z-axis minimizes deformation under high load or eccentric load conditions.

• Test temperature range: -40 ℃ to 200 ℃; self-developed diverse chucks solve core process challenges and deliver precise temperature control.

III. Core Functional Features

High-Precision Alignment

Equipped with an optical microscope with magnification ranging from 50× to 800× and a CCD vision system for automatic alignment. The positioning accuracy of X/Y/Z axes reaches ±1 μm, with repeat positioning accuracy ≤0.5 μm, suitable for fine test points such as microvias on HDI boards and BGA packaging pads.

Multi-Type Electrical Testing

Natively supports DC parameter tests (voltage / current / resistance) and continuity tests (open / short circuit). An optional RF module enables high-frequency S-parameter tests (return loss / insertion loss) and TDR impedance tests, with maximum support for millimeter-wave testing up to 110 GHz.

Flexible Probe Configuration

2 to 8 probe arms are optional, featuring 360° rotation and multi-dimensional adjustment to accommodate single-ended / differential signal testing. Custom probes (pointed / flat / spring probes) are available for test points with ultra-fine pitch down to 0.1 mm, and probe replacement is convenient.

Compatibility with Full-Spec PCBs

Compatible with rigid PCBs, flexible printed circuits (FPC), rigid-flex boards and packaging substrates. Test sizes range from 50×50 mm to 610×500 mm. The standard vacuum chuck prevents warpage of flexible boards that impairs test accuracy.

Automation & Efficiency Improvement

Fully automatic models support automatic loading/unloading, automatic point searching, automatic testing and result judgment, with a single test point cycle of 0.4–1 second, and can generate test reports in PDF/Excel formats. Semi-automatic and manual models feature simple operation for small-batch R&D prototyping.

Anti-Interference & Stable Performance

The frame adopts high-rigidity cast iron and vibration isolation design to reduce vibration interference during testing. RF test versions come with a standard electromagnetic shielding chamber to suppress signal noise and ensure accurate high-frequency test data.

Compatibility & Expandability

Seamlessly integrates external instruments including source meters, oscilloscopes, network analyzers and ICT test systems, and supports secondary development via LabVIEW. Certain models enable simultaneous double-sided testing to greatly boost test efficiency.

IV. Application Scenarios & Fields

The PCB probe station covers full-lifecycle PCB testing, widely applied from R&D design verification to mass production quality control, across general electronics and high-end high-frequency industries. Core application scenarios and fields are as follows:

1. PCB R&D & Design Verification

Design verification of new-material PCBs (high-frequency copper-clad laminates), high-speed PCBs (PCIe 5.0/6.0, DDR5) and HDI boards. Conduct tests on Signal Integrity (SI) / Power Integrity (PI), impedance matching, high-frequency insertion loss and return loss to optimize PCB routing and stack-up design.

2. Mass Production Quality Inspection

Rapid inline screening of mass-produced PCBs to detect manufacturing defects such as open circuits, short circuits, cold solder joints and resistance deviation. It replaces traditional flying probe testers to improve mass production efficiency, suitable for batch PCB testing of consumer electronics, automotive electronics and industrial control equipment, with support for test data traceability and quality analysis.

3. Packaging Substrate & Microassembly Testing

Precision testing of semiconductor packaging substrates (FC-BGA, COF) and microassembly circuit boards. It performs electrical continuity and high-frequency characteristic tests on ultra-fine-pitch pads and microvias to guarantee the reliability of semiconductor packaging and microassembly.

4. Special Testing for High-Frequency / High-Speed PCBs

High-frequency RF testing for PCBs used in 5G/6G communication, automotive millimeter-wave radar (77/81 GHz), high-speed data center backplanes and satellite communication equipment. It verifies S-parameters and impedance characteristics in the millimeter-wave band to ensure high-frequency signal transmission performance.

5. Flexible Printed Circuit (FPC) Testing

Continuity and dynamic bending tests on FPCs and rigid-flex boards for consumer electronics (smartphones, tablets) and wearable devices. The vacuum chuck eliminates FPC warpage and facilitates reliability verification after bending cycles.

6. Electronic Equipment Maintenance & Failure Analysis

Fault localization for communication equipment, industrial control motherboards and server mainboards, enabling rapid detection of PCB open/short circuits and poor component soldering. PCB Failure Analysis (FA) identifies performance degradation caused by interlayer short circuits, microvia defects and material aging.

7. Specialized PCB Testing for Segmented Industries

Compliance testing of automotive-grade PCBs (AEC-Q100 standard), high-reliability aerospace PCBs and precision medical electronic PCBs, meeting stringent industrial standards and ensuring long-term PCB reliability.

Device appearance drawing