I. Product Overview

The CS Compact Probe Station adopts an integrated desktop design developed by ABN. Featuring a compact footprint, the system is equipped with precision micromanipulator probe arms, an optical alignment system and a vacuum chuck. It enables micron-level accurate contact with test points on chips, wafers (≤2 inches), miniature PCBs and micro-nano devices. When paired with external instruments such as source meters, multimeters and oscilloscopes, it completes basic electrical performance tests including DC parameters, low-frequency frequency response and continuity measurement.

The system delivers micron-level positioning accuracy with flexible probe configuration and low operation barriers. It requires no dedicated laboratory space and can be deployed on ordinary lab benches. As a cost-effective solution for small-sample testing, teaching experiments and preliminary R&D, it widely satisfies basic characterization demands in microelectronics, materials science, optoelectronic devices and related fields.

II. Equipment Parameters

III. Core Functional Features

Compact Desktop Layout

The unit is small and lightweight with a footprint of less than 0.2 ㎡. No dedicated installation space is required; it can be placed on standard lab benches and teaching workstations, featuring easy relocation and storage.

Micron-Level Precision Positioning

Probe arms adopt precision micromanipulator structures with independent fine-tuning along X/Y/Z axes, delivering positioning accuracy of ±1 μm to realize contact with tiny test points on small samples and micro-nano devices.

Flexible Probe Configuration

4 general-purpose probe arms are supplied as standard, arranged in a 360° circular layout with independent height and angle adjustment. Compatible with pointed, flat and spring test probes. Probe replacement requires no specialized tools for user-friendly operation.

Full Compatibility with Basic Electrical Tests

Natively supports DC tests (voltage, current, resistance, continuity) and low-frequency frequency response measurements. It seamlessly connects to common test peripherals including source meters, multimeters, oscilloscopes and lock-in amplifiers.

Simplified Optical Alignment

A high-magnification metallurgical microscope comes standard for clear observation of sample pads and probe tips. An optional CCD vision module enables real-time image display to lower alignment difficulty.

Stable Sample Mounting

Equipped with a vacuum chuck for fast securing of small wafers, bare dies and miniature PCBs, preventing sample shifting during measurement to guarantee test repeatability. The stage allows horizontal fine adjustment to accommodate irregular specimens.

Cost-Effective & User-Friendly

Low procurement cost, consumable-free maintenance and no requirement for professional operators. New users can operate it after brief training, ideal for teaching experiments and preliminary R&D screening.

Moderate Expandability

Optional upgrades include CCD vision alignment, simple electromagnetic shielding cover and expanded probe arms (max. 6 channels), supporting mild upgrades from basic to intermediate testing requirements.

IV. Application Scenarios & Fields

The CS-4 compact probe station targets entry-level, basic testing of small-sized samples, covering university teaching, preliminary research and small-batch sample screening. It is widely used for fundamental characterization in microelectronics, materials science and optoelectronics, with detailed applications as follows:

1. University Teaching ExperimentsClassroom teaching and lab training for majors including microelectronics, materials science and electronic information engineering. Typical tests include basic semiconductor device characterization, PCB continuity experiments and material resistivity measurement. Suitable for undergraduate and postgraduate basic lab courses to help students intuitively understand probe testing principles and operation.

2. Preliminary R&D & Sample ScreeningPreliminary electrical performance screening of chips, micro-nano devices and new material samples for SMEs and startup teams. It rapidly evaluates basic properties such as continuity, resistance and I-V curves to filter qualified samples for subsequent high-precision testing and cut R&D expenses.

3. Small-Size Chip & Wafer TestingBasic DC characterization of semiconductor wafers (≤2 inches), bare dies and micro-packaged chips, including I-V/C-V measurement of MOSFETs, diodes and transistors for lab-scale small-batch wafer testing and device performance analysis.

4. Micro-Nano Materials & Device TestingBasic electrical characterization of 2D materials (graphene, MoS₂), nano thin films and micro-nano sensors, such as preliminary measurement of material resistivity and carrier concentration, as well as verification of switching and response performance of micro-sensors.

5. Miniature PCB & Flexible Circuit TestingContinuity and basic resistance testing of miniature PCBs and flexible printed circuits (FPC) for consumer electronics and wearable devices, applicable to prototyping screening of small-format flexible boards.

6. Basic Optoelectronic Device TestingPreliminary photoelectric response characterization of micro LEDs, photodetectors and quantum dot micro-devices. Paired with light sources and photoelectric testers, it verifies device switching performance and fundamental photoelectric conversion properties.

Equipment appearance drawing