CYMagnetic Probe Station and Bracket

1. Product Overview

The CY series mid-range probe stations adopt a semi-automatic modular design, available in two main models: desktop type (CL-6D) and vertical type (CL-6L). They are core-equipped with a high-precision optical alignment system (metallographic microscope + CCD vision), precision electric/manual hybrid probe arms, and a vacuum adsorption sample stage. Some models integrate simple temperature control and electromagnetic shielding modules.

The equipment boasts a positioning accuracy of ±1μm and a repeat positioning accuracy of ≤0.8μm. It is compatible with various specimens including 2–4 inch wafers, PCBs up to 300×300mm, packaged chips (QFN/BGA/TO packages), and optoelectronic devices. It can seamlessly connect to peripheral instruments such as source meters, network analyzers, lock-in amplifiers, and oscilloscopes to perform mid-to-high-level tests covering DC parameters, high-frequency radio frequency (up to 40GHz), I-V/C-V characteristics, photoelectric response, Hall effect, and more.

Balancing ease of operation and testing expandability, the complete machine supports manual fine-tuning and semi-automatic programmed testing. It does not require an ultra-clean room and can be deployed in ordinary laboratories or pilot workshops, making it a highly suitable option for research and development as well as medium-batch testing.

II. Equipment Parameters

SizeWeight

Optional accessories: heating stage, monitor, RF test accessories, shielding box, gold-plated chuck for optical platform, optoelectronic test accessories, high-voltage test accessories, quick tilting device for microscope, laser system, probe card fixture

# III. Core Functional Features

Semi-automatic Composite Operation: The core shaft system features electric adjustment, supporting semi-automatic program-based point searching, alignment and testing as well as manual fine-tuning correction, balancing efficiency and precision. It can store over 100 test point programs for one-click recall during repeated testing, drastically reducing manual operation errors.

Micron-level High-precision Positioning: The electric probe arm adopts precision ball screw paired with grating ruler feedback, delivering a positioning accuracy of ±1μm. It meets the alignment requirements of tiny test points on wafers, fine PCBs and micro-nano devices, with superior test repeatability compared to mid-range equivalent products.

Full Compatibility with Multi-specification Samples: The vacuum adsorption sample stage enables precise clamping for 2–4 inch wafers, and is also compatible with small and medium-sized PCBs/FPCs and various packaged chips. Equipped with scales and quick-release positioning blocks, the stage allows sample replacement and positioning within only 1 to 2 minutes.

Multi-test Compatibility for DC/RF/Optoelectronics: Natively supports DC testing (I-V/C-V/Hall effect/resistivity measurement). Standard configuration covers DC to 18GHz radio frequency testing, with optional 40GHz RF modules and optoelectronic test modules to realize integrated "electrical + RF + optoelectronic" testing.

Flexible Modular Expansion: Probe arms (expandable from 4 to 6 channels), RF performance (upgradable from 18GHz to 40GHz), temperature control modules (-40℃ to 150℃) and electromagnetic shielding covers can be installed as needed without overall equipment reconstruction, accommodating gradual upgrades of testing requirements.

High-definition Visual Alignment System: Dual vision consisting of a metallurgical microscope and high-resolution CCD, paired with a high-definition display for real-time alignment view presentation. It supports image capture and point marking with magnification ranging from 50× to 1000× and zero visual blind spots, enabling new operators to complete precise alignment rapidly.

Stable Anti-interference Design: The equipment adopts a high-rigidity cast iron base with shock-absorbing foot pads to effectively mitigate environmental vibration interference. RF models come with a built-in electromagnetic shielding cavity as standard to suppress electromagnetic noise and guarantee data accuracy for high-frequency and weak-signal testing.

High Efficiency for Batch Testing: Under semi-automatic program-controlled testing mode, the test duration for a single measuring point is ≤2 seconds. It supports continuous automatic testing of multiple points, suitable for R&D pilot trials and small-batch product quality inspection, boosting efficiency by 3 to 5 times compared with manual probe stations.

Low-cost & Convenient Maintenance: The entire machine adopts a modular design for easy disassembly and replacement of components. Daily maintenance only requires cleaning probes and the sample stage with no special consumables needed. The electric shaft system boasts low failure rates and simple after-sales maintenance, suited for long-term use in laboratories and workshops.

# IV. Application Scenarios and Fields

The mid-range probe stations of the CY series focus on the dual demands of **"precision testing for R&D + medium-batch quality inspection"**, covering mid-tier testing scenarios in fields including semiconductors, electronic manufacturing, optoelectronic devices and new materials. They are suitable for key university laboratories, medium-sized electronics enterprises and semiconductor R&D teams. The specific application scenarios are listed as follows:

1. Pilot R&D Testing of Semiconductor Wafers / Chips

Pilot testing for 2–4 inch silicon-based / compound semiconductor wafers (GaAs/GaN) and bare dies, including characterization of I-V/C-V characteristics, Hall effect and carrier mobility, as well as high-frequency parameter testing of RF devices below 18 GHz, to support pilot verification for chip process optimization.

2. R&D and Medium-Batch Quality Inspection of Small & Medium-Sized PCB/FPC

R&D verification and medium-batch quality inspection of small and medium-sized PCBs, FPCs and rigid-flex boards for consumer electronics and wearable devices. It detects open/short circuits and resistance deviation, and verifies high-frequency signal transmission performance, catering to performance validation and small-batch quality control after product prototyping.

3. R&D Testing of RF Devices

R&D testing for 5G RF front-end components, Bluetooth/Wi-Fi modules and compact millimeter-wave devices (≤18 GHz). It conducts S-parameter (return loss / insertion loss), noise figure and high-frequency I-V tests to verify the RF performance and reliability of devices.

4. Performance Testing of Packaged Chips

Medium-batch quality inspection of finished chips packaged in QFN/BGA/TO and other forms, including DC parameter testing, functional continuity testing and low-frequency RF testing for rapid screening of defective products, matching the medium-batch production quality control needs of medium-sized chip manufacturers.

5. R&D and Testing of Optoelectronic Devices

Photoelectric characteristic testing of micro LEDs, photodetectors, laser diodes and quantum dot optoelectronic devices. Combined with light sources and photoelectric testers, it implements photoelectric response and optical power-current characteristic tests to support R&D and small-batch verification of optoelectronic components.

6. Characteristic Characterization of New Materials / Micro-Nano Devices

Electrical and magnetoelectric performance testing of two-dimensional materials such as graphene and MoS₂, nano thin films and micro-nano sensors, including resistivity, Hall effect and magnetoresistance characteristic tests, applicable to new material research projects in key university laboratories.

7. Testing of Small Automotive Electronic Devices

Basic performance and reliability testing of automotive-grade compact RF devices and sensor chips. It performs DC/RF tests under room temperature and simple temperature control conditions to verify device performance stability under temperature variations, serving the R&D and small-batch quality inspection of automotive electronics manufacturers.

Device appearance drawing