I. Product Overview

The Aibona ELA Micro-Nano Material Cutting & Transfer System is an integrated platform combining laser precision cutting and high-precision transfer tailored for the fabrication of two-dimensional materials and micro-nano devices. Based on Energy-controlled Laser Ablation (ELA) technology, the system performs non-contact high-precision cutting of graphene, TMDs (MoS₂, WS₂, WSe₂, etc.), black phosphorus, h-BN and thin-film micro-nano structures, while accomplishing microscopic alignment, pick-up and precise transfer on a single workstation.

Deeply integrating laser processing, microscopic imaging and multi-degree-of-freedom precision motion control, the equipment balances flexible scientific research and stable industrial processing. It is applicable to cutting-edge research and process development scenarios including 2D material device construction, heterostructure assembly, micro-nano fabrication and functional material transfer.

II. System Features & Technical Advantages

1. Integrated Design of Laser Cutting and TransferLaser micro-region cutting, sample pick-up and transfer are completed on one unified platform, eliminating contamination and alignment errors caused by repeated sample handling. It supports continuous "cut-pick-place" operation workflows.

2. Energy-Controllable Micro-Nano Laser ProcessingLaser energy, pulse width and repetition frequency can be precisely tuned to minimize the heat-affected zone and reduce material damage. It is suitable for ultra-thin, brittle materials and heterogeneous interface materials.

3. High-Resolution Microscopic Imaging & Precise AlignmentEquipped with a long-working-distance microscopic system for real-time observation of cutting edges and transfer procedures. Its micro-region alignment accuracy meets the requirements for micro-nano device fabrication.

4. Multi-Degree-of-Freedom High-Precision Transfer StageAdopts multi-axis precision displacement and angle adjustment, enabling microscale heterostructure assembly and rotational alignment. Compatible with various substrates and sample sizes.

5. Modular & Expandable ArchitectureThe laser, microscopic and transfer modules are independently upgradable. Additional functions such as heating, vacuum adsorption and inert atmosphere environment can be expanded to accommodate diverse demands from fundamental research to pilot-scale processes.

III. Typical Application Fields

Micro-patterning and shaping of two-dimensional materials;Precision assembly of van der Waals heterostructures;Fabrication of channel and electrode regions for micro-nano devices;Sample preparation for flexible electronics and optoelectronic devices;Process exploration and verification of novel low-dimensional materials.

IV. Technical Specifications

1. Laser Cutting System

Laser Type: Solid-state / Semiconductor laser (optional)Operating Wavelength: 355 nm / 532 nm / 1064 nm (optional)Output Power: ≤5 W (continuous or pulsed output optional)Pulse Width: Picosecond / Nanosecond level (optional)Laser Energy Adjustment Accuracy: ≤1%Minimum Cutting Line Width: ≤1 μm (material-dependent)

2. Microscopic Imaging System

Imaging Mode: Bright field / Dark field (optional)Objective Lens: Long working distance objectiveMagnification: 50× – 500× (expandable)Imaging Resolution: Sub-micron levelObservation Mode: Real-time coaxial or lateral observation

3. Transfer & Motion Stage

Displacement Axes: High-precision X / Y / Z three-axis motionTravel Range: X / Y: ≥25 mm; Z: ≥10 mmMinimum Step Resolution: ≤0.1 μmAngle Adjustment: θ rotation ±180° (optional)Repeat Positioning Accuracy: ≤0.5 μm

4. Sample & Substrate Compatibility

Sample Size: Millimeter to inch scaleSubstrate Materials: Si / SiO₂ / Sapphire / Glass / PI, etc.Fixing Method: Vacuum adsorption / Mechanical clamping (optional)

5. Control & Software

Control Mode: Centralized control via PC softwareIntegrated Functions: Laser parameter adjustment, motion stage linkage, real-time microscopic displayOperation Mode: Manual / Semi-automaticData Interfaces: USB / Ethernet

6. Operating Environment

Operating Temperature: 18–28 ℃Relative Humidity: ≤60%Applicable Environment: Compatible with laboratories and cleanrooms

V. Summary of Product Positioning

The Aibona ELA Micro-Nano Material Cutting and Transfer System is positioned as an integrated research instrument combining "micro-nano processing and precise transfer". It can serve as one of the core platforms for two-dimensional material laboratories, and together with Aibona’s existing two-dimensional material transfer stations, probe stations, lithography systems, Raman spectroscopy and microscopic imaging equipment, it forms a complete solution for the fabrication and characterization of micro-nano devices.

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