The ABNER-UM series maskless lithography machine by Aibona is an ultraviolet direct-write lithography system based on digital micromirror devices (DMD). It targets application scenarios including micro-nano device research and development, two-dimensional material device fabrication, MEMS process verification, and scientific research and teaching in universities. The system loads pattern data directly via a computer and projects designed patterns onto the photoresist surface in real time. It enables lithography processing featuring no physical mask requirement, rapid iteration and high-precision exposure, significantly cutting process costs and shortening R&D cycles. The equipment balances high-resolution imaging and system stability. Adopting a modular optical path design and high-precision motion stage, it supports multiple ultraviolet wavebands and sample sizes, and is particularly suitable for scientific research and pilot-scale trial demands characterized by small-batch production, diverse schemes and frequent pattern modifications.
I. Core Product Advantages
Maskless Direct Writing
No photomask fabrication required; layout modifications take effect immediately, greatly reducing R&D costs and time.
High-Resolution UV Imaging
Adopts a high-numerical-aperture projection optical system to achieve sub-micron linewidth processing capability.
High-Speed DMD Dynamic Exposure
Grayscale/binary exposure control based on digital micromirror devices, supporting complex patterns and gradient structures.
High-Precision Motion and Alignment
Precision motorized stage, supporting multi-area stitching exposure and repeat positioning.
Open Process Compatibility
Compatible with mainstream positive and negative photoresists, suitable for various substrate materials and device structures.
Research-Friendly Software
Supports layout formats including GDSII / DXF / BMP, featuring intuitive operation and ideal for laboratory environments.
II. Typical Application Fields
2D material devices (Graphene, MoS₂, WSe₂, etc.)
Micro-nano electronic and optoelectronic devices
MEMS / microstructure prototype verification
Microfluidic chips
Teaching experiments for new materials and new processes
Preliminary mask process evaluation and rapid verification
III. Technical Specifications (ABNER-UV Standard Configuration)
1. Lithography system
Operating wavelength
| Parameter item | Technical Indicators |
|---|
| Photolithography method | UV Maskless Direct Writing (DMD Projection) |
| Light source type | High stability UV LED / UV laser (optional) |
| 365 nm（i-line） / 385 nm / 405 nm（Optional） |
|
| Exposure method | Binary / Grayscale Exposure |
| Exposure uniformity | ≥ 90% |
| Light intensity adjustment | Software adjustable, supports multi-level exposure energy control |
2. DMD and imaging systems
Microscope size
| Parameter item | Technical indicators |
|---|
| DMD resolution | 1920 × 1080 |
| 7.56 μm |
|
| Projection scaling ratio | 1× / 2× / 5× / 10×（Optional） |
| Minimum feature line width | ≤ 1.0 μm（Related to photoresist and processes） |
| imaging distortion | ≤ 1% |
3. Motion and Sample Stage
| Parameter item | Technical indicators |
|---|
| Stage type | Precision Electric XY Stage |
| Travel range | XY：100 mm × 100 mm（Customizable） |
| Repositioning Accuracy | ≤ ±1 μm |
| Z Axis focusing | Electric / Manual fine adjustment |
| Sample size | Chips / 2–4 inch wafers (scalable up to 6 inches) |
| fixed method | Vacuum adsorption / Mechanical clamping |
4. Alignment and Stitching
| Parameter item | Technical indicators |
|---|
| Alignment method | Optical Microscopy Alignment |
| Alignment degrees of freedom | X / Y / θ |
| Spliced exposure | Support |
| Splicing error | ≤ ±1 μm（typical value） |
5. Software and Control System
| Parameter item | Technical indicators |
|---|
| Layout format | GDSII / DXF / BMP / PNG |
| Exposure Control | Area Exposure, Grayscale Control, Array Exposure |
| Operating System | Windows |
| Control method | Graphical Interface（GUI） |
| Data interface | USB / Ethernet |
6. System and Environment Requirements
| Parameter item | Technical indicators |
|---|
| power supply | AC 220V ±10%，50 Hz |
| Work environment | 20–25 ℃，Humidity ≤ 60% |
| Overall dimensions | about 1200 × 800 × 1600 mm（Reference） |
| Installation environment | Laboratory / Cleanroom |
Working principle
