# I. Product Overview
The AIBONA UD-S maskless UV lithography system is a digital lithography direct-write platform for scientific research and pilot production lines. It uses **spatial light modulators (DMD / SLM)** for pattern projection exposure, eliminating the fabrication and alignment procedures of traditional photomasks, and enabling a rapid closed loop from layout import to exposure imaging. The system is compatible with various photoresist systems and a wide range of substrate materials. It is suitable for prototype verification of micro-nano structures, device process exploration and multi-batch parameter scanning experiments, balancing resolution, efficiency and scalability.
# II. Typical Applications
Micro-nano device prototypes: microelectrode arrays, microfluidic channels, MEMS structures, sensor patterns; Materials and process research: photoresist window screening, exposure dose matrix, development process evaluation; 2D materials and micro-nano fabrication: electrode patterns, gate structures, alignment marks, patterned transfer auxiliary structures; Teaching and open laboratories: low-threshold digital lithography training platform
III. Core Features
No photomask required: Direct digital patterning to reduce consumable and iteration costs
Rapid iteration: Supports matrix experiments for parameters such as dose, focus and stitching strategy
Compatibility with diverse substrates: Wafer, glass, sapphire, Si/SiO₂, flexible substrates, etc.
Scalable alignment capability: Optional front/backside alignment and support for multi-layer stacking processes
Modular configuration: Exposure head, stage, alignment microscopy and software modules can be upgraded according to applications
4. Technical Specifications
(1) Exposure and Imaging System
Exposure Mode: Digital Projection Direct Writing (DMD/SLM Spatial Light Modulation); Light Source Wavelength: 365 nm / 405 nm (385 nm, i-line, etc. optional); Light Source Type: High-stability LED / Semiconductor Laser (depending on configuration); Exposure Uniformity: ≥ 85% (typical value, subject to field of view and correction method); Light Intensity Adjustment: Continuously adjustable via software + hardware safety limiting; Focusing Mode: Manual Precision Focusing / Motorized Auto Focus (optional)
(2) Resolution and Field of View (related to objective lens / projection magnification)
Minimum Line Width: 1–2 μm (typical); ≤ 1 μm available for high-end configuration (optional); Alignment Mark Recognition: Supports common marks such as cross, square and array; Field of View (FOV): Typically 0.5–2 mm (varies with magnification configuration); Stitching Exposure: Supported (software automatic stitching / grid exposure)
(3) Substrate Carrying and Motion Stage
Compatible Substrates: 2/4/6-inch wafers (8-inch optional), small piece samples; Stage Type: High-precision XY motorized stage + Z focusing stage; XY Travel Range: ≥ 100 mm × 100 mm (customizable); Z Travel Range: ≥ 10 mm (typical); Repeat Positioning Accuracy: ≤ ±1 μm (typical, higher grade optional for premium configuration); Vacuum Chucking: Wafer vacuum chuck (multi-specification adapter plate optional); θ Adjustment: Manual / Motorized θ (optional, for alignment convenience)
(4) Alignment System (Multi-layer Exposure Capability)
Alignment Mode: Microscopic imaging alignment + software-assisted alignment; Alignment Degrees of Freedom: X / Y / θ; Overlay Alignment Accuracy: ≤ 1.5–2 μm (typical); Higher accuracy available as an optional solution; Backside Alignment: Optional (transmission / infrared backside alignment depends on specific substrates)
(5) Software and Data Interfaces
Layout Import: GDSII / DXF / BMP / PNG (depending on software modules); Exposure Strategy: Vector filling / grid exposure / grayscale exposure (optional); Process Library: Supports recipe saving, recall and permission management; Motion Control: Automatic mark search, automatic stitching, exposure queue; Data Logging: Exposure logs, dose parameters, export for process traceability; Interfaces: USB / Ethernet; SDK available (optional)
(6) Environment and Power Supply
Operating Environment: Temperature 20–26 ℃; Humidity 30–70% RH (no condensation). Cleanliness Requirement: Class 1000–10000 recommended (depending on processes). Power Supply: AC 220 V, 50/60 Hz; Equipment Safety: Laser/UV interlock, misoperation prevention, emergency stop, door interlock (depending on configuration)
(7) Equipment Dimensions and Delivery
Overall Dimensions: Benchtop / Floor-standing (depending on configuration, customizable); Delivery Scope: Main unit, exposure head, stage, industrial control computer, software, user manual, calibration documents; Optional Accessories: Spin coater interface, hot plate / baking station, developing tank, clean enclosure, process package
Working Principle
