B Series of maskless lithography machines

 I. Product Introduction

The Abner B-series maskless lithography machine is a high-precision direct-write lithography device designed for research institutions and advanced process R&D scenarios. Adopting digital spatial light modulation technology, the system enables maskless direct exposure of patterns. It effectively addresses the drawbacks of traditional mask lithography, including long mask fabrication cycles, high costs and low iteration efficiency. It is especially suitable for rapid prototype verification of micro-nano structures, multi-version process development and small-batch customized manufacturing. Built around the core design concept of "high stability + high scalability", the B-series balances system modularity and upgrade flexibility while guaranteeing exposure accuracy and repeatability. Widely applied in cutting-edge research fields such as micro-nano devices, MEMS, 2D materials, photonic devices, microfluidic chips and new functional materials, the equipment serves as critical process hardware for research and pilot-scale production stages.

 II. Technical Information and Core Advantages

1. Maskless Digital Direct-Write Technology

The system performs pattern projection exposure based on a digital light modulation array. Design layouts (GDS/DXF/BMP, etc.) are loaded directly via software to rapidly map patterns onto substrates. No physical mask is required, which greatly reduces process costs. Patterns can be modified in real time to accommodate multiple rounds of process iteration. Designs of complex, aperiodic, gradient and irregular structures are supported.

2. High-Precision Optical Exposure System

The B-series features an optimized ultraviolet optical system to ensure uniform exposure spots and sharp edge definition:

- Ultraviolet band exposure compatible with mainstream photoresist systems

- High-contrast imaging to improve line edge quality

- Stable optical path for long-duration continuous operation

3. High-Stability Motion and Alignment Stage

The equipment integrates high-precision electric displacement and automatic alignment modules to achieve multi-area stitching and repeated exposure. It delivers high repeat positioning accuracy to meet micro-nano scale fabrication requirements. Automatic stitching exposure is supported to expand the effective processing area. Automatic and semi-automatic alignment modes are optional to fit different experimental workflows.

4. Software and System Integration Capability

The B-series is equipped with self-developed control software that achieves deep integration of layout processing, exposure parameter configuration and motion control: multi-format layout import and pattern scaling are available; exposure dose, grayscale and stepping parameters are programmable; the intuitive operation logic allows researchers to get started quickly.

5. Modular and Scalable Design

The system reserves multiple upgrade interfaces to satisfy users' future process expansion needs: functions including automatic alignment and dual-band exposure can be extended; it is adaptable to samples of various sizes and special substrates; compatible with laboratory cleanroom environments and open platform layouts.

 III. Typical Application Fields

Prototype verification of micro-nano structures and functional devices; process development of MEMS devices and multi-layer structures; fabrication of 2D material devices and electrode patterning; manufacturing of microfluidic chips and biochips; research on photonic crystals and diffractive optical elements

IV. Technical Parameters

Sample size