1. Product Overview
The UV-Y maskless UV lithography system is a high-precision direct-write lithography equipment for the micro-nano manufacturing field. Adopting advanced ultraviolet maskless direct-write lithography technology and integrating high-precision motion control, optical imaging and real-time process monitoring systems, it enables direct lithographic forming of micro-nano 2D/3D structures without photomask fabrication. Featuring high precision, great flexibility and wide compatibility, the equipment supports rapid design iteration in the research and development stage and small-batch pilot production. It meets the manufacturing demands of micro-nano structures across multiple fields including microelectronics, MEMS, microfluidics and biomedicine, serving as the core micro-nano processing equipment for laboratories and small-batch production lines. The machine boasts numerous advantages of maskless lithography machines, and its desktop design facilitates teaching applications. Furthermore, the equipment is optimized for educational scenarios with simplified operation procedures for easier student operation. With this equipment, students can gain a more intuitive understanding of lithography technology, master advanced lithography processing techniques and improve practical capabilities, laying a foundation for future scientific research work. The application of UV-Y in the education sector helps cultivate more outstanding scientific and technological talents.
II. Equipment Specifications
| Core Parameters | Technical Indicators |
|---|
| photolithography light source | Dual light sources of 365nm/405nm in ultraviolet band are optional with adjustable power.（10~100mW） |
| Minimum feature size | ≤1μm（365nm light source），≤3μm（405nm light source） |
| Lithography precision | Overlay accuracy ≤ ±0.5μm, positioning accuracy ≤ ±0.2μm, repeat positioning accuracy≤±0.1μm |
| Effective lithography area | Max 100×100mm² (supports splicing to expand to 200×200mm²） |
| Lithography depth | 0.1~1000μm（Supports high-aspect-ratio structures and enables layered photolithography） |
| Layered lithography step size | 0.05~10μm adjustable |
| Scanning mode | Vector scanning / area array scanning dual mode optional, scanning speed 0.1~100mm/s |
| Substrate Adaptation | Silicon wafers, glass, quartz, polymers, metal foils, etc., substrate thickness 0.1~5mm |
| Alignment method | Automatic visual alignment (CCD camera + image recognition algorithm, magnification: 200~1000×) |
| Operating system | Windows Professional version, equipped with independent lithography design software (compatible with DXF/GDSII/STL formats) |
| Equipment Dimensions | Desktop type / vertical type optional, desktop type approx. 800×600×900mm, vertical type approx. 1200×800×1500mm |
| 工作环境 | Temperature: 23±2℃, Humidity: 40~60% RH, no vibration and dust-free (suitable for Class 1000 / Class 10000 cleanrooms) |
| Power Supply Requirements | AC220V±10%，50/60Hz，Maximum power 1500W |
III. Functional Features
Dual-light-source maskless direct writing: Free switching between 365 nm / 405 nm dual ultraviolet light sources to meet lithography requirements of different photosensitive materials. No photomask is needed, which eliminates the cost of photomask fabrication and replacement and greatly shortens the process cycle.
High-precision multi-mode lithography: Supports dual modes of vector scanning and area array scanning. Vector scanning is suitable for fine microstructures while area array scanning improves the processing efficiency of large-size areas. The minimum feature size is as low as 1 μm to satisfy requirements of different precision levels.
Automatic visual alignment and stitching: A high-magnification CCD vision system enables automatic alignment and real-time positioning. It supports stitching for large lithography areas with stitching accuracy ≤±0.8 μm, enabling the fabrication of ultra-large-area micro-nano structures.
Real-time process monitoring and feedback: Optical images are captured in real time during lithography to online inspect structural forming quality and inter-layer alignment accuracy. Real-time adjustment of process parameters is supported to prevent yield reduction caused by process deviations.
High-aspect-ratio structure processing: The optimized ultraviolet focusing system and lithography process allow lithography of high-aspect-ratio structures (aspect ratio ≥50:1), meeting manufacturing demands for special structures such as microchannels, micropillar arrays and microneedles.
Compatibility with multiple substrates and materials: Compatible with various substrates including silicon, glass, quartz and flexible polymers, as well as all types of UV photosensitive materials such as photoresist, photosensitive resin, biocompatible photosensitive materials and ceramic photosensitive slurry, adapting to process requirements in diverse fields.
Intelligent process management: Equipped with dedicated lithography design software, it supports graphic editing, presetting of process parameters and saving of processing workflows. It enables standardization and reuse of process parameters and lowers the operating threshold for users. Remote monitoring and operation are supported to improve equipment usability.
Compact design and low loss: Desktop and vertical types are optional with a small footprint, suitable for layout in laboratories and small production lines. The light source has a long service life (≥20000 h). Consumables only include lithography materials and cleaning supplies, resulting in low operating costs.
IV. Application Scenarios and Fields
Microelectronics and Semiconductors: MEMS devices (microsensors, microactuators), RF microdevices, semiconductor packaging leads, microelectrode arrays
Micro-Electro-Mechanical Systems (MEMS): Micromechanical structures such as microgears, microsprings, micropumps, microvalves, and microcantilevers
Microfluidic Chips: Photolithography forming and mold fabrication for microchannels, droplet generators, mixers, bioassay chips, and organ-on-chips
Biomedicine: Microneedle arrays (transdermal drug delivery), biosensor chips, microstructures for medical implants, cell culture microarrays
Optical Microdevices: Microlens arrays, gratings, optical waveguides, micro-optical metasurface structures
New Materials and Metamaterials: Lattice structures of mechanical metamaterials, phononic crystals, photonic crystals, microstructures of functionally graded materials
Precision Manufacturing: Micro molds, microstructures of precision connectors, miniature sensor components, micro-sized aerospace devices
V. Technical Advantages
Excellent balance of precision and flexibility: The minimum feature size is ≤1μm, and the overlay and positioning accuracy reaches the sub-micron level. Meanwhile, the maskless direct-write mode eliminates the constraints of photomasks. Modified design schemes can be immediately applied for lithography, greatly improving R&D iteration efficiency (the cycle is reduced by more than 80% compared with traditional mask lithography).
Outstanding high-aspect-ratio processing capability: Through optical system optimization and lithography process tuning, micro-nano structures with an aspect ratio ≥50:1 can be fabricated, with sidewall roughness ≤Ra10nm. The structure achieves excellent forming quality to meet the high-aspect-ratio requirements in fields such as microfluidics and MEMS.
Strong adaptability to multiple scenarios: Equipped with dual light sources, dual scanning modes, and compatibility with various substrates and materials. It can satisfy both the small-batch and multi-variety demands of laboratory R&D and the standardized small-batch production requirements of production lines. A single piece of equipment covers multi-stage processes.
High yield and process stability: Real-time visual monitoring plus closed-loop feedback of process parameters effectively avoids problems during lithography, including position deviation, uneven light intensity and non-uniform material coating. The lithography yield is ≥95%. Process parameters can be saved in a standardized manner to ensure consistency between batches.
Good stitching expansion and integration: It supports stitching and expansion of effective lithography areas to meet the manufacturing of large-size microstructures. The equipment is reserved with standard interfaces and can connect with micro-nano processing equipment such as spin coaters, developers and bake plates to form an automated lithography process line.
Low cost and easy maintenance: The mask-free process design greatly reduces upfront investment and subsequent maintenance costs. The light source adopts long-life ultraviolet LEDs without frequent replacement. The equipment has a built-in self-diagnosis and alarm system for simple maintenance and lower equipment management costs.
3D structure direct-write capability: It supports layered lithography and 3D vector scanning, enabling direct lithographic forming of simple 3D micro-nano structures. No additional mold preparation or post-processing is required, which simplifies the manufacturing process of 3D microstructures.
Working Imaging Diagram
