The Abner CM Semi-Automatic Prober is a research-grade electrical testing platform designed for semiconductor devices, two-dimensional materials and micro-nano electronics research. Adopting a semi-automatic design concept of "motor-driven precision motion + manual fine adjustment", the system delivers outstanding positioning accuracy, stable probe contact and consistent test repeatability while featuring a compact structure and controllable costs, making it suitable for long-term stable operation in universities, research institutes and corporate R&D laboratories. Centered on a high-rigidity sample stage, the CM system supports precise XYZ displacement and micron-level positioning control. Its multi-degree-of-freedom probe system enables fine tuning of probes along the X, Y and Z axes as well as pitch and yaw angles, ensuring reliable contact with microelectrodes and micro-nano devices. The system can be flexibly equipped with a metallurgical microscope or long-working-distance microscopic imaging system to realize real-time sample observation and precise alignment.
I. Technical Features
(1) Semi-automatic precision positioning system: Combines motorized XYZ stage with manual fine-tuning mechanisms to balance operating efficiency and precision control
(2) High-stability mechanical structure: The overall high-rigidity design effectively mitigates the impact of mechanical vibration on low-current and low-noise testing
(3) Multi-degree-of-freedom probe adjustment: Allows fine tuning of probes along XYZ axes, as well as pitch and yaw angle adjustment to boost probe contact success rate
(4) Excellent system compatibility: Compatible with a wide range of probe arms, microscopes and electrical testing instruments (source meters, LCR meters, etc.)
(5) Optimized for research and teaching: Intuitive operation and low maintenance costs, ideal for simultaneous device research and teaching experiments
II. Main Technical Parameters
Mechanical Motion Parameters
| Project | Parameters |
|---|
| Stage Type | Semi-automatic XYZ Precision Stage |
| X / Y Itinerary | ≥ 50 mm × 50 mm |
| Z Axis travel | ≥ 10 mm |
| Minimum Step / Resolution | ≤ 1 μm |
| Repetitive Positioning Accuracy | ≤ ±2 μm |
Maximum sample size| 4-inch wafers (larger sizes customizable) |
|
| Sample Fixing Method | Vacuum adsorption / Mechanical compression (optional) |
Probe System Parameters
| Project | parameters |
|---|
| Number of probe arms | Standard configuration: 2–4 arms (expandable) |
| Adjustment Degrees of Freedom of Probe | XYZ Fine-tuning + pitch / yaw angle adjustment |
| Minimum feed resolution of the probe | ≤ 1 μm |
| Probe Compatibility | Coaxial Probes, DC Probes, RF Probes (Optional) |
| Maximum test current | mA Level (depends on probe and cable configuration) |
显微与观测系统
| Project | parameters |
|---|
| Type of Microscopy System | Metallurgical Microscope / Long Working Distance Microscopy System |
Observation Method| Brightfield / Darkfield (Optional) |
|
| Alignment Method | Manual Alignment for Real-Time Microscopic Observation |
| Camera Interface | USB / HDMI（Optional） |
电学测试接口
| Project | parameters |
|---|
| Test interface | BNC / Triaxial (optional) |
| Compatible instruments | Source meters, LCR meters, parameter analyzers, etc. |
| Application Test | I–V、C–V、low current test, etc. |
III. Typical Application Scenarios
I-V / C-V characteristic testing of semiconductor devices; electrical transport performance research of two-dimensional material devices; electrical testing of MEMS microstructures; teaching experiments of micro-nano electronics and device physics in universities.
