I. Product Overview

The ABN CR Dual-Side Probe Station features a vertical integrated modular design. It is centrally equipped with upper/lower independent dual probe station systems, dual high-resolution vision alignment modules, precision motorized linkage stages, and dual vacuum chucks. It enables synchronous precise alignment and independent adjustment of upper and lower probes, achieving a positioning accuracy of ±0.5 μm and a repeat positioning accuracy of ≤0.3 μm.

The system accommodates wafers up to 8 inches, double-sided PCB/FPC/substrate carriers up to 450×450 mm, power devices, MEMS devices and other samples. It can seamlessly connect with peripheral instruments including source meters, network analyzers, and high-low temperature thermal control systems. It supports synchronous double-sided measurements including DC parameters, I-V/C-V curves, high-frequency RF tests (standard: DC~40 GHz, optional: 110 GHz), and cryogenic-to-high-temperature testing (-80 ℃ ~ 200 ℃). Three operating modes are available: manual, semi-automatic and fully automatic. It covers the full workflow of R&D prototyping, pilot verification and mass quality inspection, solving the key industry pain point of repeated re-fixturing and large alignment errors when using conventional single-sided probe stations for double-sided testing.

Core Basic Specifications

• Compatible Samples: 8-inch maximum wafers, double-sided PCB/FPC/package carriers up to 450×450 mm, power devices, MEMS devices, and semiconductor packaged chips

• Positioning Accuracy: ±0.5 μm for X/Y/Z axes of upper/lower probe stations; dual-stage linkage alignment accuracy ≤0.8 μm

• Probe Arms: 4 channels each on upper and lower sides (expandable to 6 channels), with motorized adjustment + manual fine-tuning, 360° rotation and ±10° tilt adjustment

• Optical System: Upper/lower dual metallurgical microscopes + high-definition industrial CCD, magnification 50~1200×, supporting synchronous dual-view display and precise alignment calibration

• Sample Stages: Dual upper/lower vacuum chucks with horizontal fine adjustment and graduated positioning, compatible with integrated high-low temperature thermal control modules

• RF Performance: Standard DC~40 GHz, optional 110 GHz millimeter-wave RF configuration, with dual-side RF shielding and grounding design

• Test Modes: Manual fine-tuning, semi-automatic programmed testing, fully automatic loading/unloading (optional)

• Overall Dimensions & Weight: Vertical form factor ≈ 850×750×1200 mm, net weight ≤ 120 kg, footprint < 0.7 m²

II. Equipment Specifications

Optional Accessories

Heating chuck, monitor, adapters, RF test accessories, shielding box, optical table, gold-plated chuck, optoelectronic test accessories, high-voltage test accessories, microscope quick tilt assembly, laser system, probe card fixture

III. Core Features

1. Synchronous High-Precision Dual-Stage AlignmentIndependent motorized control and linkage calibration for upper and lower dual probe stations, with real-time synchronous dual vision display and automatic alignment error compensation. It achieves ±0.5 μm positioning accuracy and eliminates positioning errors caused by re-fixturing in conventional double-sided testing.

2. Independent & Flexible Dual-Side AdjustmentThe upper/lower probe stations and probe arms allow independent adjustment of height, angle and pitch, supporting alignment for asymmetric double-sided test points. It meets customized test requirements for irregular double-sided devices and PCBs with non-uniform layouts.

3. Full Compatibility with Diverse Sample SizesDual vacuum chucks enable precise positioning for 8-inch wafers, as well as double-sided PCB/FPC, package carriers and power devices of various sizes. The quick-release positioning blocks allow sample replacement within 1–3 minutes.

4. Multi-Mode Testing Compatibility: DC / RF / Thermal CyclingNative support for synchronous double-sided DC measurements (I-V/C-V, continuity, Hall effect testing), standard 40 GHz high-frequency RF double-sided testing, and optional 110 GHz millimeter-wave modules. An integrated thermal control system supports testing across -80 ℃ ~ 200 ℃ for synchronous double-sided measurements under variable temperature conditions.

5. Three Selectable Test Modes

• Manual mode: for fine-tuning during R&D

• Semi-automatic mode: stores over 1000 test points for one-click repeat testing

• Fully automatic mode (auto loader optional): for high-efficiency mass production quality controlBalances flexible debugging and high-volume throughput.

1. High-Definition Dual Vision Alignment SystemDual upper/lower industrial CCD cameras plus high-magnification metallurgical microscopes, with synchronous dual-view display, precise alignment calibration, image capture, point marking and error correction. Magnification ranges from 50× to 1200×, eliminating blind spots for ultra-fine test points.

2. High-Stability Anti-Interference DesignA rigid cast iron mainframe plus double-layer vibration-isolation feet effectively suppress ambient vibration interference. The RF version features a built-in dual-port electromagnetic shielding enclosure and RF grounding for both upper and lower probe stations, reducing electromagnetic noise and ensuring measurement accuracy for high-frequency weak signals.

3. Highly Modular & Expandable ArchitectureUpper/lower probe arms can be expanded from 4 channels to 6 channels; RF bandwidth can be upgraded from 40 GHz to 110 GHz. Compatible with automatic loading/unloading chambers, thermal control modules and data traceability systems without major system modification, accommodating future test upgrades.

4. High-Efficiency Synchronous Double-Sided TestingIn semi-automatic mode, single-point synchronous double-sided testing takes ≤1.5 seconds, eliminating repeated flipping and re-fixturing. It delivers 6–8× faster throughput compared to traditional single-sided probe stations and significantly reduces manual operation costs.

5. Full-Lifecycle Digital Data ManagementSupporting industrial control software for parameter configuration, real-time data acquisition, curve plotting, and automatic report export. Compatible with MES systems for full data traceability and statistical analysis, fulfilling digital quality control requirements for mass production.

IV. Application Fields & Scenarios

The CR Dual-Side Probe Station is developed for synchronous double-sided testing, addressing key measurement challenges for double-layer PCBs, dual-pin components, and integrated packaged products. It is widely adopted in advanced electronics manufacturing, semiconductor packaging, PCB R&D, power device characterization, MEMS testing, and more, covering R&D validation, pilot production, and mass quality inspection workflows.

1. High-End Double-Sided PCB / Package Carrier TestingSynchronous double-sided testing of 5G base station high-speed PCBs, data center backplanes, and FC-BGA/COF semiconductor package substrates. Performs continuity verification, impedance matching, and S-parameter measurements up to 40 GHz to validate signal integrity, supporting R&D and mass inspection of high-end PCBs.

2. 8-inch Semiconductor Wafer Double-Sided CharacterizationElectrical testing of double-sided silicon and compound semiconductor (GaN/SiC) wafers, including I-V/C-V curves, carrier mobility and Hall effect measurements. Supports R&D and pilot verification for double-doped wafers and devices with double-sided electrodes.

3. Power Device / Semiconductor Packaged Chip TestingSynchronous double-sided testing of IGBT/MOSFET power devices and dual-pin packaged chips (QFP/BGA), including DC parameters, switching characteristics, and thermal reliability validation across temperature ranges. Eliminates re-fixturing to improve testing speed and data consistency.

4. MEMS & Microelectromechanical Device TestingDouble-sided characterization of MEMS sensors, micro-actuators, micro gyroscopes and other microdevices, including electrical performance, optoelectronic response and dynamic property measurements. Enables micron-level dual-side precision alignment for MEMS R&D and low-volume production.

5. Flexible Double-Sided FPC & Rigid-Flex PCB TestingSynchronous double-sided validation for high-end consumer electronics FPCs and wearable rigid-flex boards, including continuity checks and bending reliability tests. Vacuum chucking prevents warpage of flexible substrates and maintains precise probe contact.

6. Automotive Grade Electronic Component TestingDouble-sided validation of automotive PCBs, on-board power devices and millimeter-wave radar RF components, with synchronous electrical and RF testing across -40 ℃ ~ 150 ℃. Complies with AEC-Q100 automotive qualification standards to meet strict automotive reliability requirements.

7. High-Reliability Aerospace Electronics TestingSynchronous double-sided verification for aerospace high-reliability PCBs and radiation-hardened devices, including continuity checks, thermal cycling validation and interference immunity testing. Ensures stable signal transmission and electrical performance under extreme operating conditions.

8. Semiconductor Packaging Pilot & Mass Production Quality ControlMass electrical and RF testing for packaged chips and substrates in semiconductor packaging fabs. Fully automatic mode enables unattended continuous testing to support high-throughput quality assurance in volume manufacturing.

Equipment Appearance Diagram